- 您现在的位置：买卖IC网 > PDF目录80758 > MA4GP030120 100 V, GALLIUM ARSENIDE, PIN DIODE PDF资料下载
参数资料
| 型号： | MA4GP030120 |
| 元件分类： | PIN二极管 |
| 英文描述： | 100 V, GALLIUM ARSENIDE, PIN DIODE |
| 封装： | ROHS COMPLIANT, CASE 120, 2 PIN |
| 文件页数： | 6/6页 |
| 文件大小： | 327K |
| 代理商： | MA4GP030120 |
RoHS Compliant
V1
GaAs PIN Diode Chips
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product
information.
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care to avoid damage or contamination
from perspiration, salts, and skin oils. The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk handling should ensure that abrasion and
mechanical shock are minimized.
Die Attach Surface: Die can be mounted with an 80Au/Sn20, eutectic solder preform, RoHS
compliant solders or electrically conductive silver epoxy. The metal RF and D.C. ground plane
mounting surface must be free of contamination and should have a surface flatness of < ±0.002”.
Eutectic Die Attachment Using Hot Gas Die Bonder: A work surface temperature of 255oC is
recommended. When hot forming gas is applied, the work area temperature should be approximately
290
oC. The chip should not be exposed to temperatures greater than 320oC for more than 10
seconds.
Eutectic Die Attachment Using Reflow Oven: See Application Note M541, “Bonding and Handling
Procedures for Chip Diode Devices” at www.macom.com for recommended time-temperature profile.
Electrically Conductive Epoxy Die Attachment: A controlled amount of electrically conductive,
silver epoxy, approximately 1–2 mils in thickness, should be used to minimize ohmic and thermal
resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement to
ensure full area coverage. Cure conductive epoxy per manufacturer’s schedule. Typically 150°C for
1 hour.
Wire and Ribbon Bonding: It is recommended that thermo-compression or thermo-sonic bonding
be used with little or no ultrasonics. The bonding tool and wire or ribbon used should be smaller than
the anode contact diameter. A bonder heat stage temperature setting of 200
oC, tool tip temperature
of 150°C and a force of 18 to 50 grams is suggested. If ultrasonic scrubbing is necessary it should be
adjusted to the minimum required to achieve a good bond. Excessive energy may cause the anode
metallization to separate from the chip.
For more detailed handling and assembly instructions, see Application Note M541,
“Bonding and Handling Procedures for Chip Diode Devices” at www.macom.com.
相关PDF资料 |
PDF描述 |
|---|---|
| ML4705S-30 | 10 GHz - 12 GHz, SILICON, CONTINUOUS WAVE IMPATT DIODE |
| ML4706-30 | 12 GHz - 14 GHz, SILICON, CONTINUOUS WAVE IMPATT DIODE |
| MA156 | SILICON, SIGNAL DIODE |
| MV1626 | 12 pF, 20 V, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE, DO-7 |
| MV2112A | 56 pF, 30 V, SILICON, ABRUPT VARIABLE CAPACITANCE DIODE, DO-7 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4GP030-120 | 制造商:M/A-COM Technology Solutions 功能描述:GAAS PIN DIODE - Bulk |
| MA4GP030-276 | 制造商:M/A-COM Technology Solutions 功能描述:GAAS PIN DIODE CHIP - Bulk |
| MA4GP030-277 | 制造商:M/A-COM Technology Solutions 功能描述:DIODE,PIN,CHIP,GAAS - Bulk 制造商:M/A-COM Technology Solutions 功能描述:RF PIN DIODE |
| MA4GP030-30 | 制造商:M/A-COM Technology Solutions 功能描述:GAAS PIN DIODE - Bulk |
| MA4GP030-31 | 制造商:M/A-COM Technology Solutions 功能描述:GAAS PIN DIODE - Bulk |
发布紧急采购，3分钟左右您将得到回复。