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参数资料
| 型号： | MA4SPS552 |
| 元件分类： | PIN二极管 |
| 英文描述： | 200 V, SILICON, PIN DIODE |
| 封装： | DIE-2 |
| 文件页数： | 2/6页 |
| 文件大小： | 152K |
| 代理商： | MA4SPS552 |
Surface Mount PIN Diode Chip
MA4SPS552 SurMount
TM Series
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
2
V 1.00
Electrical Specifications: @ +25 °C
Symbol
Conditions
Units
Min.
Typ.
Max.
CT
-40 V, 1 MHz
pF
0.08
0.14
CT
-40 V, 1 GHz
pF
0.06
RS
100 mA, 100 MHz
1.7
RS
20 mA, 100 MHz
2.4
VF
100 mA
V
1.00
1.25
VF
10 mA
V
0.86
1.00
VR
-10
A
V
l -200 l
l -275 l
IR
-40 V
nA
l -10 l
RθJL
Steady State
°C/W
30
TL
(50% - 90% V)
+10 mA / -6 mA
s
2.5
Parameter
Total
Capacitance
Total
Capacitance
Series
Resistance
Series
Resistance
Forward Voltage
Reverse Voltage
Reverse Leakage
Current
Thermal
Resistance
Minority Carrier
Lifetime
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils.
The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components.
Bulk
handling should insure that abrasion and mechanical shock
are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use
of
surface
mount
technology.
Mounting
pads
are
conveniently located on the bottom surface of these diodes
and are removed from the active junction locations. These
devices are well suited for solder attachment onto hard and
soft substrates.
The use of 80/20 Au/Sn and 60/40 Sn/Pb
solder is recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for attachment
may also be used.
When soldering these devices to a hard substrate, hot gas
die bonding is preferred.
We recommend utilizing a
vacuum tip and a force of 60 to 100 grams applied
normal to the top surface of the device. When soldering
to soft substrates, it is recommended to use a lead-tin
interface at the circuit board mounting pads. Position
the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by
heating the circuit trace near the mounting pad while
applying 60 to 100 grams of force perpendicular to the
top surface of the die.
Since the HMIC glass is transparent, the edges of the
mounting pads closest to each other can be visually
inspected through the die after attach is completed.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MA4SPS552-T | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode |
| MA4SPS552-W | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode |
| MA4ST079 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Hyperabrupt Wide-Band Tuning Varactors |
| MA4ST079_1 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Hyperabrupt Wide-Band Tuning Varactors |
| MA4ST080 | 制造商:MA-COM 制造商全称:M/A-COM Technology Solutions, Inc. 功能描述:Surface Mount Hyperabrupt Wide-Band Tuning Varactors |
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