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参数资料
| 型号： | MADP-000402-12530P |
| 元件分类： | PIN二极管 |
| 英文描述： | SILICON, PIN DIODE |
| 封装： | ROHS COMPLIANT PACKAGE-2 |
| 文件页数： | 7/7页 |
| 文件大小： | 151K |
| 代理商： | MADP-000402-12530P |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
SURMOUNTTM PIN Diode
RoHS Compliant
M/A-COM Products
Rev. V5
MA4SPS402
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses. It is also not recommended to reflow solder by causing heat to flow through
the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually
inspected through the die after attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling
Procedures for Chip Diode Devices” provides handling and assembly recommendations.
Ordering Information
MA4SPS402 SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suf-
fix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM
website at www.macom.com.
Part Number
Waffle Pack
Tape and Reel
Pocket Tape
MA4SPS402
MADP-000402-12530P
Gel Pack
MADP-000402-12530G
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