参数资料
型号: MAX1022BETX+T
厂商: Maxim Integrated Products
文件页数: 12/44页
文件大小: 0K
描述: IC ADC/DAC 10BIT W/FIFO 36-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: ADC,DAC
分辨率(位): 10 b
采样率(每秒): 225k
数据接口: MICROWIRE?,QSPI?,串行,SPI?
电压电源: 模拟和数字
电源电压: 4.75 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 36-WFQFN 裸露焊盘
供应商设备封装: 36-TQFN 裸露焊盘(6x6)
包装: 带卷 (TR)
MAX1020/MAX1022/MAX1057/MAX1058
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VDVDD = 2.7V to 3.6V (MAX1057), external reference VREF = 2.5V (MAX1057), VAVDD = VDVDD = 4.75V to 5.25V
(MAX1020/MAX1022/MAX1058), external reference VREF = 4.096V (MAX1020/MAX1022/MAX1058), fCLK = 3.6MHz (50% duty cycle),
TA = -40°C to +85°C, unless otherwise noted. Typical values are at VAVDD = VDVDD = 3V (MAX1057), VAVDD = VDVDD = 5V
(MAX1020/MAX1022/MAX1058), TA = +25°C. Outputs are unloaded, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +6V
DGND to AGND.....................................................-0.3V to +0.3V
DVDD to AVDD......................................................-3.0V to +0.3V
Digital Inputs to DGND.............................................-0.3V to +6V
Digital Outputs to DGND ........................-0.3V to (VDVDD + 0.3V)
Analog Inputs, Analog Outputs and REF_
to AGND .............................................-0.3V to (VAVDD + 0.3V)
Maximum Current into Any Pin (except AGND, DGND, AVDD,
DVDD, and OUT_)...........................................................50mA
Maximum Current into OUT_.............................................100mA
Continuous Power Dissipation (multilayer board, TA = +70°C)
36-Pin TQFN (6mm x 6mm)
(derate 35.7mW/°C above +70°C) ......................2857.1mW
48-Pin TQFN (7mm x 7mm)
(derate 40mW/°C above +70°C) ............................3200mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ADC
DC ACCURACY (Note 1)
Resolution
10
Bits
Integral Nonlinearity
INL
±0.5
±1.0
LSB
Differential Nonlinearity
DNL
±0.5
±1.0
LSB
Offset Error
±0.25
±2.0
LSB
Gain Error
(Note 2)
±0.025
±2.0
LSB
Gain Temperature Coefficient
±1.4
ppm/°C
Channel-to-Channel Offset
±0.1
LSB
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, VIN = 2.5VP-P (MAX1057), VIN = 4.096VP-P (MAX1020/MAX1022/MAX1058),
225ksps, fSCLK = 3.6MHz)
Signal-to-Noise Plus Distortion
SINAD
61
dB
Total Harmonic Distortion
(Up to the Fifth Harmonic)
THD
-70
dBc
Spurious-Free Dynamic Range
SFDR
66
dBc
Intermodulation Distortion
IMD
fIN1 = 9.9kHz, fIN2 = 10.2kHz
72
dBc
Full-Linear Bandwidth
SINAD > 70dB
100
kHz
Full-Power Bandwidth
-3dB point
1
MHz
CONVERSION RATE (Note 3)
External reference
0.8
s
Power-Up Time
tPU
Internal reference (Note 4)
218
Conversion
Clock
Cycles
Note: If the package power dissipation is not exceeded, one output at a time may be shorted to AVDD, DVDD, AGND, or DGND
indefinitely
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