- 您现在的位置：买卖IC网 > PDF目录9885 > MAX11055ECB+ (Maxim Integrated Products)IC ADC 14BIT PAR 250KSPS 64TQFP PDF资料下载
参数资料
| 型号： | MAX11055ECB+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 16/28页 |
| 文件大小： | 0K |
| 描述： | IC ADC 14BIT PAR 250KSPS 64TQFP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 160 |
| 位数： | 14 |
| 采样率（每秒）： | 250k |
| 数据接口： | 并联 |
| 转换器数目： | 6 |
| 功率耗散（最大）： | 3.48W |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-TQFP 裸露焊盘 |
| 供应商设备封装： | 64-TQFP-EP（10x10） |
| 包装： | 管件 |
| 输入数目和类型： | 6 个单端，双极 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页当前第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
4-/6-/8-Channel, 16-/14-Bit,
Simultaneous-Sampling ADCs
23
Maxim Integrated
MAX11044/MAX11044B/MAX11045/MAX11045B/
MAX11046/MAX11046B/MAX11054/MAX11055/MAX11056
Layout, Grounding, and Bypassing
For best performance use PCBs with ground planes.
Ensure that digital and analog signal lines are separated
from each other. Do not run analog and digital lines paral-
lel to one another (especially clock lines), and avoid run-
ning digital lines underneath the ADC package. A single
solid GND plane configuration with digital signals routed
from one direction and analog signals from the other pro-
vides the best performance. Connect DGND, AGND, and
AGNDS pins on the MAX11044/MAX11044B/MAX11045/
MAX11045B/MAX11046/MAX11046B and MAX11054/
MAX11055/MAX11056 to this ground plane. Keep the
ground return to the power supply for this ground low imped-
ance and as short as possible for noise-free operation.
To achieve the highest performance, connect all the
RDC pins (22, 28, 35, 43, 49 for the TQFN package, or
pins 27, 33, 40, 48, 54 for the TQFP package) to a local
RDC plane on the PCB. In addition, on the TQFP pack-
age, the RDC_SENSE pins 26 and 55 should be directly
connected to this RDC plane as well. Bypass the RDC
outputs with a total of at least 80μF of capacitance. If
two capacitors are used, place each as close as possi-
ble to pins 22 and 49 (TQFN) or pins 27 and 54 (TQFP).
If four capacitors are used, place each as close as pos-
sible to pins 22, 28, 43, and 49 (TQFN) or pins 27, 33,
48, and 54 (TQFP). For example, two 47μF, 10V X5R
capacitors in 1210 case size can be placed as close as
possible to pins 22 and 49 (TQFN package) will provide
excellent performance. Alternatively, four 22μF, 10V
X5R capacitors in 1210 case size placed as close as
possible to pins 22, 28, 43, and 49 (TQFN package) will
also provide good performance. Ensure that each
capacitor is connected directly into the AGND plane
with an independent via.
If Y5U or Z5U ceramics are used, be aware of the high-
voltage coefficient these capacitors exhibit and select
higher voltage rating capacitors to ensure that at least
80μF of capacitance is on the RDC plane when the
plane is driven to 4.096V by the built-in reference
buffer. For example, a 22μF X5R with a 10V rating is
approximately 20μF at 4.096V, whereas, the same
capacitor in Y5U ceramic is just 13μF. However, a Y5U
22μF capacitor with a 25V rating cap is approximately
20μF at 4.096V.
Bypass AVDD and DVDD to the ground plane with
0.1μF ceramic chip capacitors on each pin as close as
possible to the device to minimize parasitic inductance.
Add at least one bulk 10μF decoupling capacitor to
AVDD and DVDD per PCB. Interconnect all of the
AVDD inputs and DVDD inputs using two solid power
planes. For best performance, bring the AVDD power
plane in on the analog interface side of the
MAX11044/MAX11044B/MAX11045/MAX11045B/
MAX11046/MAX11046B and MAX11054/MAX11055/
MAX11056 and the DVDD power plane from the digital
interface side of the device.
For acquisition periods near minimum (1μs) use a 1nF
C0G ceramic chip capacitor between each of the chan-
nel inputs to the ground plane as close as possible to
the MAX11044/MAX11044B/MAX11045/MAX11045B/
MAX11046/MAX11046B and MAX11054/MAX11055/
MAX11056. This capacitor reduces the inductance
seen by the sampling circuitry and reduces the voltage
transient seen by the input source circuit.
Typical Application Circuits
Power-Grid Protection
Figure 10 shows a typical power-grid protection application.
DSP Motor Control
Figure 11 shows a typical DSP motor control application.
Definitions
Integral Nonlinearity (INL)
INL is the deviation of the values on an actual transfer
function from a straight line. For these devices, this
straight line is a line drawn between the end points of
the transfer function, once offset and gain errors have
been nullified.
Differential Nonlinearity (DNL)
DNL is the difference between an actual step width and
the ideal value of 1 LSB. For these devices, the DNL of
each digital output code is measured and the worst-case
value is reported in the
Electrical Characteristics table. A
DNL error specification of greater than -1 LSB guaran-
tees no missing codes and a monotonic transfer func-
tion. For example, -0.9 LSB guarantees no missing code
while -1.1 LSB results in missing code.
Offset Error
The offset error is defined as the input voltage required
to cause the MAX11044/MAX11044B/MAX11045/
MAX11045B/MAX11046/MAX11046B digital output to
be centered on code 0x8000 (offset binary) or 0x0000
(two’s complement) and the MAX11054/MAX11055/
MAX11056 digital output to be centered on code 0x0000
(offset binary) or 0x0000 (two’s complement). Ideally, this
input voltage should be 0V with respect to AGNDS.
Gain Error
Gain error is defined as the difference between the
change in analog input voltage required to produce a top
code transition minus a bottom code transition, subtract-
ed from the ideal change in analog input voltage on
(10/4.096) x VREF x (65,534/65,536) for 16-bit, or
相关PDF资料 |
PDF描述 |
|---|---|
| VE-J32-MX-F4 | CONVERTER MOD DC/DC 15V 75W |
| MS27474E20B35PD | CONN RCPT 79POS JAM NUT W/PINS |
| MAX1090ACEI+ | IC ADC 10BIT 400KSPS 28-QSOP |
| MS27474E20B35PC | CONN RCPT 79POS JAM NUT W/PINS |
| VI-2WH-MX-F1 | CONVERTER MOD DC/DC 52V 75W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX11055ECB+ | 功能描述:模数转换器 - ADC 14Bit 6Ch Simult Sampling RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX11055ECB+T | 功能描述:模数转换器 - ADC 14Bit 6Ch Simult Sampling RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX11056 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:4-/6-/8-Channel, 16-/14-Bit, Simultaneous-Sampling ADCs |
| MAX11056ECB+ | 功能描述:模数转换器 - ADC 14Bit 8Ch Simult Sampling RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX11056ECB+T | 功能描述:模数转换器 - ADC 14Bit 8Ch Simult Sampling RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
发布紧急采购，3分钟左右您将得到回复。