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参数资料
| 型号： | MAX11060GUU+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 27/35页 |
| 文件大小： | 0K |
| 描述： | IC ADC 16BIT DELTA SIGMA 38TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 位数： | 16 |
| 采样率（每秒）： | 3.07M |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 4 |
| 功率耗散（最大）： | 1.1W |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 106°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 38-TFSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 38-TSSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 8 个单端，双极；4 个差分，双极 |
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MAX11040K/MAX11060
24-/16-Bit, 4-Channel, Simultaneous-Sampling,
Cascadable, Sigma-Delta ADCs
33
Maxim Integrated
To compensate the result of an FFT for the devices’ out-
put data:
1) Calculate the inverse (1/x) of the equation provided
in the
Digital Filter section for each frequency in the
FFT.
2) Multiply the FFT of the devices’ output data by the
result of the above step.
Power Supplies
AVDD and DVDD provide power to the devices. The
AVDD powers up the analog section, while the DVDD
powers up the digital section. The power supply for
AVDD and DVDD ranges from +3.0V to +3.6V and 2.7V
to VAVDD, respectively. Bypass AVDD to AGND with a
1μF electrolytic capacitor in parallel with a 0.1μF ceramic
capacitor and bypass DVDD to DGND with a 1μF elec-
trolytic capacitor in parallel with a 0.1μF ceramic capaci-
tor. For improved performance, place the bypass
capacitors as close as possible to the device.
Layout, Grounding, and Bypassing
The best layout and grounding design always comes
from a thorough analysis of the complete system. This
includes the signal source’s dependence and sensitivi-
ty on ground currents, and knowledge of the various
currents that could travel through the various potential
grounding paths.
Use PCBs with separate analog and digital ground
planes. Connect the two ground planes together only at
the devices’ GND input. Isolate the digital supply from
the analog with a low-value resistor (10
Ω) or ferrite
bead when the analog and digital supplies come from
the same source.
Ensure that digital return currents do not pass through
the analog ground and that return-current paths are low
impedance. A 5mA current flowing through a PCB
ground trace impedance of only 0.05
Ω creates an error
voltage of approximately 250μV.
Ensure that digital and analog signal lines are kept sepa-
rate. Do not run digital (especially the SCLK and DOUT)
lines parallel to any analog lines or under the devices.
Lay out the traces in perpendicular directions when a
digital line and an analog line cross each other.
Bypass AVDD to the analog ground plane with a 0.1μF
capacitor in parallel with a 1μF to 10μF low-ESR capac-
itor. Keep capacitor leads short for best supply-noise
rejection. Bypass REF+ and REF- with a 0.1μF capaci-
tor to GND. Place all bypass capacitors as close as
possible to the device for optimum decoupling.
Crystal Layout
Follow these basic layout guidelines when placing a
crystal on a PCB with the devices to avoid coupled
noise:
1) Place the crystal as close as possible to XIN and
XOUT. Keeping the trace lengths between the crys-
tal and inputs as short as possible reduces the
probability of noise coupling by reducing the length
of the “antennae.” Keep the XIN and XOUT lines
close to each other to minimize the loop area of the
clock lines. Keeping the trace lengths short also
decreases the amount of stray capacitance.
2) Keep the crystal solder pads and trace width to XIN
and XOUT as small as possible. The larger these
bond pads and traces are, the more likely it is that
noise will couple from adjacent signals.
3) Place a guard ring (connect to ground) around the
crystal to isolate the crystal from noise coupled from
adjacent signals.
4) Ensure that no signals on other PCB layers run
directly below the crystal or below the traces to XIN
and XOUT. The more the crystal is isolated from
other signals on the board, the less likely for noise to
couple into the crystal.
5) Place a local ground plane on the PCB layer imme-
diately below the crystal guard ring. This helps to
isolate the crystal from noise coupling from signals
on other PCB layers.
Note: Keep the ground plane in the vicinity of the
crystal only and not on the entire board.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX11068EVKIT | 功能描述:电源管理IC开发工具 Programmers, Development Systems Eval and Demo Boards and Kits - KIT SMART BATT MEASUREMENT 12CH RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX11068EVKIT+ | 功能描述:电源管理IC开发工具 Programmers, Development Systems Eval and Demo Boards and Kits - KIT SMART BATT MEASUREMENT 12CH RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX11068EVMINIQU+ | 功能描述:电池管理 Automotive Battery Sensor RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX11068GUU/V+ | 功能描述:电池管理 12Ch High-V Smart Bat Msr System RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
| MAX11068GUU/V+T | 功能描述:电池管理 12Ch High-V Smart Bat Msr System RoHS:否 制造商:Texas Instruments 电池类型:Li-Ion 输出电压:5 V 输出电流:4.5 A 工作电源电压:3.9 V to 17 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:VQFN-24 封装:Reel |
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