参数资料
型号: MAX1110EVL11-DIP
厂商: Maxim Integrated Products
文件页数: 8/20页
文件大小: 0K
描述: EVAL KIT FOR MAX1110
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
ADC 的数量: 1
位数: 8
采样率(每秒): 50k
数据接口: 串行
输入范围: 0 ~ VREF
在以下条件下的电源(标准): 0.23mW @ 50kSPS
工作温度: 0°C ~ 70°C
已用 IC / 零件: MAX1110,MAX1112
已供物品: 2 板,CD
Applications Information
Power-On Reset
When power is first applied, and if SHDN is not pulled
low, internal power-on reset circuitry activates the
MAX1110/MAX1111 in internal clock mode. SSTRB is
high on power-up and, if CS is low, the first logical 1 on
DIN is interpreted as a start bit. Until a conversion takes
place, DOUT shifts out zeros. No conversions should
be performed until the reference voltage has stabilized
(see
Electrical Characteristics).
Power-Down
When operating at speeds below the maximum sam-
pling rate, the MAX1110/MAX1111’s automatic power-
down mode can save considerable power by placing
the converters in a low-current shutdown state between
conversions. Figure 13 shows the average supply cur-
rent as a function of the sampling rate.
Select power-down with PD1 of the DIN control byte
with SHDN high or high impedance (Table 3). Pull
SHDN low at any time to shut down the converters com-
pletely. SHDN overrides PD1 of the control byte.
Figures 14a and 14b illustrate the various power-down
sequences in both external and internal clock modes.
Software Power-Down
Software power-down is activated using bit PD1 of the
control byte. When software power-down is asserted, the
ADCs continue to operate in the last specified clock
mode until the conversion is complete. The ADCs then
power down into a low quiescent-current state. In internal
clock mode, the interface remains active, and conversion
results can be clocked out after the MAX1110/
MAX1111 have entered a software power-down.
The first logical 1 on DIN is interpreted as a start bit,
which powers up the MAX1110/MAX1111. If the DIN byte
contains PD1 = 1, then the chip remains powered up. If
PD1 = 0, power-down resumes after one conversion.
Hard-Wired Power-Down
Pulling SHDN low places the converters in hard-wired
power-down. Unlike software power-down, the conversion
is not completed; it stops coincidentally with SHDN being
brought low. SHDN also controls the state of the internal
reference (Table 5). Letting SHDN high impedance
enables the internal 2.048V voltage reference. When
returning to normal operation with SHDN high impedance,
there is a tRC delay of approximately 1MΩ x CLOAD,
where CLOAD is the capacitive loading on the SHDN pin.
Pulling SHDN high disables the internal reference, which
saves power when using an external reference.
External Reference
An external reference between 1V and VDD should be
connected directly at the REFIN terminal. The DC input
impedance at REFIN is extremely high, consisting of
leakage current only (typically 10nA). During a conver-
sion, the reference must be able to deliver up to 20A
average load current and have an output impedance of
1kΩ or less at the conversion clock frequency. If the
reference has higher output impedance or is noisy,
bypass it close to the REFIN pin with a 0.1F capacitor.
If an external reference is used with the MAX1110/
MAX1111, connect SHDN to VDD to disable the internal
reference and decrease power consumption.
MAX1110/MAX1111
+2.7V, Low-Power, Multichannel,
Serial 8-Bit ADCs
16
______________________________________________________________________________________
Table 5. Hard-Wired Power-Down and
Internal Reference State
SHDN
STATE
DEVICE
MODE
1
Enabled
High Impedance
Enabled
0
Power-Down
INTERNAL
REFERENCE
Disabled
Enabled
1000
1
010
30
50
10
100
MAX1110-fig13
SAMPLING RATE (ksps)
SUPPLY
CURRENT
A)
20
40
VDD = VREFIN = 3V
CLOAD AT DOUT AND SSTRB
CLOAD = 30pF
CODE = 11111111
CLOAD = 30pF
CODE = 10101010
CLOAD = 60pF
CODE = 10101010
Figure 13. Average Supply Current vs. Sampling Rate
相关PDF资料
PDF描述
LGU2G151MELB CAP ALUM 150UF 400V 20% SNAP
0210490270 CABLE JUMPER 1.25MM .203M 20POS
EBC13DRTN-S93 CONN EDGECARD 26POS DIP .100 SLD
380LX151M400K012 CAP ALUM 150UF 400V 20% SNAP
ESC05DRTH-S93 CONN EDGECARD 10POS DIP .100 SLD
相关代理商/技术参数
参数描述
MAX1110MJP 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32
MAX1111 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:+2.7V, Low-Power, Multichannel, Serial 8-Bit ADCs
MAX11110 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:2Msps/3Msps, Low-Power, Serial 12-/10-/8-Bit ADCs
MAX11110AUT+ 制造商:Maxim Integrated Products 功能描述:SMALL, 2.2V TO 3.6V, LOW-POWER, 1-/2-CHANNEL, SERIAL, 8-/10- - Rail/Tube
MAX11110AUT+T 功能描述:模数转换器 - ADC 10Bit 1Ch 2Msps Serial RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32