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参数资料
| 型号： | MAX13030EEBE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 5/18页 |
| 文件大小： | 0K |
| 描述： | IC TRANSLATOR LL 6CH 16UCSP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 逻辑功能： | 变换器，双向 |
| 位数： | 6 |
| 输入类型： | 逻辑 |
| 输出类型： | 逻辑 |
| 数据速率： | 100Mbps |
| 通道数： | 6 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 6.5ns |
| 电源电压： | 2.2 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 16-WFBGA，CSPBGA |
| 供应商设备封装： | 16-UCSP（2x2） |
| 包装： | 标准包装 |
| 其它名称： | MAX13030EEBE+TDKR |
Clock Return (CLK_RET)
The MAX13035E features a CLK_RET output that returns
the clock signal applied to CLK_VL. CLK_VL and
CLK_VCC are identical to the other I/O channels, the only
difference being that CLK_VCC is internally tied to the
VCC side of CLK_RET (see the Functional Diagram).
Application Information
Layout Recommendations
Use standard high-speed layout practices when laying
out a board with the MAX13030E–MAX13035E. For
example, to minimize line coupling, place all other signal
lines not connected to the MAX13030E–MAX13035E at
least 1x the substrate height of the PCB away from the
input and output lines of the MAX13030E–MAX13035E.
Power-Supply Decoupling
To reduce ripple and the chance of introducing data
errors, bypass VL and VCC to ground with 0.1F ceram-
ic capacitors. Place all capacitors as close as possible
to the power-supply inputs. For full ESD protection,
bypass VCC with a 1F ceramic capacitor located as
close as possible to the VCC input.
Unidirectional vs. Bidirectional Level
Translator
The MAX13030E–MAX13035E bidirectional level trans-
lators can operate as a unidirectional device to trans-
late signals without inversion. These devices provide
the smallest solution (UCSP package) for unidirectional
level translation without inversion.
Use with External Pullup/Pulldown
Resistors
Due to the architecture of the MAX13030E–
MAX13035E, it is not recommended to use external
pullup or pulldown resistors on the bus. In certain appli-
cations, the use of external pullup or pulldown resistors
is desired to have a known bus state when there is no
active driver on the bus. For example, this may happen
when interfacing to a memory card slot with no memory
card inserted. The MAX13030E–MAX13035E include
internal pullup current sources that set the bus state
when the device is enabled. In shutdown mode,
the state of I/O VCC_ and I/O VL_ is dependent on
the selected part version (see
Ordering Information/
Selector Guide for further information).
Open-Drain Signaling
The MAX13030E–MAX13035E are designed to pass
open-drain as well as CMOS push-pull signals. When
used with open-drain signaling, the rise time is domi-
nated by the interaction of the internal pullup current
source and the parasitic load capacitance. The
MAX13030E–MAX13035E include internal rise time
accelerators to speed up transitions, eliminating any
need for external pullup resistors.
SD Card Detection
SD, MiniSD, MMC and similar types of cards provide
detection of a card through a pullup resistor on one of
the DAT lines, or by use of a mechanical switch. This
pullup resistor is internal to the memory card itself. The
MAX13030E–MAX13035E only support detection of
a memory card through a mechanical switch, and it
is recommended that the internal resistor for card
detection be switched off by the command interface.
For example, when using SD cards, the command
SET_CLR_CARD_DETECT (ACMD42) disables this
resistor.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profiles, as well as the latest information on reliabil-
ity testing results, go to Maxim’s web site at
www.maxim-ic.com/ucsp to find the Application Note:
UCSP – A Wafer-Level Chip-Scale Package.
Chip Information
Process: BiCMOS
MAX13030E–MAX13035E
6-Channel High-Speed Logic-Level Translators
______________________________________________________________________________________
13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX13030EETE+ | 功能描述:转换 - 电压电平 6Ch High-Speed RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX13030EETE+T | 功能描述:转换 - 电压电平 6Ch High-Speed RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX13031E | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX13032EEBE+ | 制造商:Maxim Integrated Products 功能描述: 制造商:Rochester Electronics LLC 功能描述: |
| MAX13032EEBE+T | 功能描述:转换 - 电压电平 6Ch High-Speed RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
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