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| 型号： | MAX13331GEE/V+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/15页 |
| 文件大小： | 0K |
| 描述： | IC AMP STEREO HEADPHONE 16-QSOP |
| 其它有关文件： | Automotive Product Guide |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 100 |
| 系列： | DirectDrive® |
| 类型： | AB 类 |
| 输出类型： | 耳机，2-通道（立体声） |
| 在某负载时最大输出功率 x 通道数量： | 135mW x 2 @ 32 欧姆 |
| 电源电压： | 4 V ~ 5.5 V |
| 特点： | 消除爆音，短路保护，关机 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 16-QSOP |
| 封装/外壳： | 16-SSOP（0.154"，3.90mm 宽） |
| 包装： | 管件 |
MAX13330/MAX13331
Automotive DirectDrive Headphone Amplifiers
with Output Protection and Diagnostics
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = VCPVDD = +5V, VSGND = VPGND = 0V, SHDN = VDD, C1 = C2 = 1F, RL =
∞, resistive load referenced to ground, for
MAX13330 gain = -1.5V/V (internally set), for MAX13331 gain = -1.5V/V (RIN = 30k
Ω, RFB = 45kΩ), TA = TJ = -40°C to +105°C, unless
otherwise noted. Typical values are at TA = +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
VDD, CPVDD to SGND..............................................-0.3V to +6V
VSS, CPVSS to SGND ...............................................+0.3V to -6V
VDD, CPVDD..........................................................-0.3V to +0.3V
VSS, CPVSS ...........................................................-0.3V to +0.3V
SHDN, DIAG to SGND................................-0.3V to (VDD + 0.3V)
OUT_ to PGND.......................................(VCPVSS - 0.3V) to +45V
IN_ to SGND (MAX13330)................(VSS - 0.3V) to (VDD + 0.3V)
IN_ to SGND (MAX13331) ..........................-0.3V to (VDD + 0.3V)
C1P to PGND........................................-0.3V to (VCPVDD + 0.3V)
C1N to PGND..............................................(VSS - 0.3V) to +0.3V
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (TA = +70°C)
QSOP (derate 9.6mW/°C above +70°C))..................771.5mW
Operating Temperature Range .........................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
QSOP
Junction-to-Ambient Thermal Resistance (
θJA) ......103.7°C/W
Junction-to-Case Thermal Resistance (
θJC) ................37°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
GENERAL
Amplifier Supply Voltage Range
VDD
4.0
5.5
V
Charge-Pump Supply Voltage
Range
VCPVDD
4.0
5.5
V
Charge-Pump Output Voltage
VCPVSS
-VDD
V
Quiescent Supply Current
IDD
RL =
10
mA
Shutdown Supply Current
ISHDN
10
μA
SHDN Input-Logic High
VIH
2
V
SHDN Input-Logic Low
VIL
0.8
V
SHDN Input Leakage Current
-1
+1
μA
SHDN to Full Operation Time
tSON
100
μs
DIAGNOSTICS
No fault
0.02 x
VDD
OUTR short to
SGND
0.22 x
VDD
0.25 x
VDD
0.28 x
VDD
OUTL short to
SGND
0.47 x
VDD
0.50 x
VDD
0.53 x
VDD
OUTR short to
VBAT
0.72 x
VDD
0.75 x
VDD
0.78 x
VDD
Diagnostic Output Voltage
VDIAG
RDIAG = ,
TA = +25°C
OUTL short to
VBAT
0.97 x
VDD
V
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相关代理商/技术参数 |
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| MAX13335EGEE/V+T | 功能描述:音频放大器 Differential Audio Input Amplifier RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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