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参数资料
| 型号： | MAX1426EAI+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 9/16页 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BITS 10MSPS 28SSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,000 |
| 位数： | 10 |
| 采样率（每秒）： | 10M |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 210mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 28-SSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 1 个差分，双极 |
MAX1426
10-Bit, 10Msps ADC
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VAVDD = VCMLP = +5V, VDVDD = +3.3V, VCMLN = VAGND = VDGND = 0V, internal reference, digital output loading 35pF, fCLK =
10MHz (50% duty cycle), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................ -0.3V to +6V
DVDD to DGND ....................................................... -0.3V to +6V
AVDD to DGND ........................................................ -0.3V to +6V
DGND to AGND ................................................................. ±0.3V
REFP, REFIN, REFN, CMLN, CMLP,
CML, INP, INN .....................(VAGND - 0.3V) to (VAVDD + 0.3V)
CLK, OE/PD, D0–D9 ...............(VDGND - 0.3V) to (VDVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
28-Pin SSOP (derated 9.5mW/°C above +70°C) .........762mW
Operating Temperature Ranges
MAX1426CAI ..................................................... 0°C to +70°C
MAX1426EAI................................................... -40°C to +85°C
Maximum Junction Temperature .................................... +150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
58
60
f = 2MHz
-70
-67
f = 2MHz
%FSR
f = 2MHz
(Note 4)
External reference (REFP, CML, REFN)
(Note 3)
External reference (REFIN) (Note 2)
Guaranteed monotonic
(Note 1)
Internal reference (Note 1)
f = 2MHz
CONDITIONS
SINAD
Signal-to-Noise and Distortion
dB
THD
Total Harmonic Distortion
(first five harmonics)
dB
69
72
SFDR
Spurious-Free Dynamic Range
dB
60
61
SNR
Signal-to-Noise Ratio
LSB
-1
1
DNL
Differential Nonlinearity
Bits
10
RES
Resolution
mV/V
-5
±2
+5
PSRR
Power-Supply Rejection Ratio
-5
±3
5
-5
±2
5
LSB
-1.5
±0.3
1.5
INL
Integral Nonlinearity
No Missing Codes
-3
±1.0
3
MSO
Midscale Offset
-10
±5
10
GE
Gain Error
UNITS
MIN
TYP
MAX
SYMBOL
PARAMETER
dB
ACCURACY
DYNAMIC PERFORMANCE (AIN = -1.0dBFS)
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