参数资料
型号: MAX15005AEVKIT+
厂商: Maxim Integrated Products
文件页数: 23/27页
文件大小: 0K
描述: KIT EVAL FOR MAX15005A
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: DC/DC,步升/步降
输出及类型: 3,隔离
输出电压: 3V,110V,60V
电流 - 输出: 650mA,55mA,12mA
输入电压: 6.5 ~ 16 V
稳压器拓扑结构: 回扫
频率 - 开关: 100kHz
板类型: 完全填充
已供物品:
已用 IC / 零件: MAX15005A
MAX15004A/B/MAX15005A/B
4.5V to 40V Input Automotive
Flyback/Boost/SEPIC Power-Supply Controllers
Layout Recommendations
Typically, there are two sources of noise emission in a
switching power supply: high di/dt loops and high dv/dt
surfaces. For example, traces that carry the drain cur-
rent often form high di/dt loops. Similarly, the heatsink
of the MOSFET connected to the device drain presents
a dv/dt source; therefore, minimize the surface area of
the heatsink as much as possible. Keep all PCB traces
carrying switching currents as short as possible to mini-
mize current loops. Use a ground plane for best results.
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. Refer to the
MAX15005 EV kit data sheet for a specific layout exam-
ple. Use a multilayer board whenever possible for bet-
ter noise immunity. Follow these guidelines for good
PCB layout:
1) Use a large copper plane under the package and
solder it to the exposed pad. To effectively use this
copper area as a heat exchanger between the PCB
and ambient, expose this copper area on the top
and bottom side of the PCB.
2) Do not connect the connection from SGND (pin 7)
to the EP copper plane underneath the IC. Use mid-
layer-1 as an SGND plane when using a multilayer
board.
Maxim Integrated
3) Isolate the power components and high-current
path from the sensitive analog circuitry.
4) Keep the high-current paths short, especially at the
ground terminals. This practice is essential for sta-
ble, jitter-free operation.
5) Connect SGND and PGND together close to the
device at the return terminal of V CC bypass capaci-
tor. Do not connect them together anywhere else.
6) Keep the power traces and load connections short.
This practice is essential for high efficiency. Use
thick copper PCBs (2oz vs. 1oz) to enhance full-
load efficiency.
7) Ensure that the feedback connection to FB is short
and direct.
8) Route high-speed switching nodes away from the
sensitive analog areas. Use an internal PCB layer
for SGND as an EMI shield to keep radiated noise
away from the device, feedback dividers, and ana-
log bypass capacitors.
9) Connect SYNC pin to SGND when not used.
23
相关PDF资料
PDF描述
F910G687KNC CAP TANT 680UF 4V 10% 2917
ECM08DTMD CONN EDGECARD 16POS R/A .156 SLD
GBM12DRSI CONN EDGECARD 24POS DIP .156 SLD
050R26-51B CABLE FLAT FLEX 26POS 0.5MM 2"
F910G477KNC CAP TANT 470UF 4V 10% 2917
相关代理商/技术参数
参数描述
MAX15005AEVKIT+ 功能描述:电源管理IC开发工具 MAX15005A Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
MAX15005BAUE/V+ 功能描述:电流型 PWM 控制器 Flyback/Boost/SEPIC Power-Supply Ctlr RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14
MAX15005BAUE/V+T 功能描述:电流型 PWM 控制器 Flyback/Boost/SEPIC Power-Supply Ctlr RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14
MAX15005BAUE+ 功能描述:电流型 PWM 控制器 Flyback/Boost/SEPIC Power-Supply Ctlr RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14
MAX15005BAUE+T 功能描述:电流型 PWM 控制器 Flyback/Boost/SEPIC Power-Supply Ctlr RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14