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| 型号： | MAX16046ETN+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/70页 |
| 文件大小： | 0K |
| 描述： | IC EE-PROG SYS MGR 12CH 56-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 37 |
| 类型： | 系统管理器 |
| 监视电压数目： | 12 |
| 输出： | 开路漏极，推挽式 |
| 复位： | 低有效 |
| 复位超时： | 可调节/可选择 |
| 电压 - 阀值： | 可调节/可选择 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 56-WFQFN 裸露焊盘 |
| 供应商设备封装： | 56-TQFN-EP（8x8） |
| 包装： | 管件 |
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MAX16046/MAX16048
12-Channel/8-Channel EEPROM-Programmable
System Managers with Nonvolatile Fault Registers
ABSOLUTE MAXIMUM RATINGS
V CC to GND ....................……………………………-0.3V to +15V
EN, MON_, SCL, SDA, A0 to GND ...........................-0.3V to +6V
GPIO_, RESET (configured as open drain) to GND.....-0.3V to +6V
EN_OUT1–EN_OUT6 (configured as open drain)
to GND.................................................................-0.3V to +12V
EN_OUT7–EN_OUT12 (configured as open drain)
to GND...................................................................-0.3V to +6V
GPIO_, EN_OUT_, RESET
(configured as push-pull) to GND .........-0.3V to (V DBP + 0.3V)
DBP, ABP to GND .........-0.3V to the lower of 3V or (V CC + 0.3V)
TCK, TMS, TDI to GND..........................................-0.3V to +3.6V
TDO to GND .............................................-0.3V to (V DBP + 0.3V)
DACOUT_ to GND....………………………-0.3V to (V ABP + 0.3V)
EN_OUT1–EN_OUT6
(configured as charge pump) to GND ....-0.3V to (V MON1–6 + 6V)
Continuous Current (all pins)............................................±20mA
TQFN (derate 47.6mW/°C above +70°C) ......................3810mW
TQFP (derate 43.5mW/°C above +70°C) ....................3478.3mW
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
56 TQFN
Junction-to-Ambient Thermal Resistance ( θ JA ).................21°C/W
Junction-to-Case Thermal Resistance ( θ JC )........................1°C/W
64 TQFP
Junction-to-Ambient Thermal Resistance ( θ JA )...................23°C/W
Junction-to-Case Thermal Resistance ( θ JC )...........................1°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V CC = 3V to 14V, T A = -40°C to +85°C, unless otherwise specified. Typical values are at V CC = 3.3V, T A = +25°C.) (Note 2)
PARAMETER
Operating Voltage Range
SYMBOL
V CC
CONDITIONS
RESET output asserted low
MIN
1.4
3
TYP
MAX
14
UNITS
V
Undervoltage Lockout
V UVLO
2.85
V
Undervoltage-Lockout Hysteresis
UVLO HYS
(Note 3)
50
mV
Supply Current
I CC
V CC = 14V, V EN = 3.3V, no load on any
output
4.8
6.5
mA
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
Internal Timing Accuracy
V DBP
V ABP
t BOOT
C DBP = 1μF, no load on any output
C ABP = 1μF, no load on any DACOUT_
V CC > V UVLO
(Note 4)
2.6
2.78
-5
2.7
2.88
0.8
2.8
2.96
1.5
+5
V
V
ms
%
ADC
ADC Resolution
MON_ range set to ‘00’ in r0Fh–r11h
10
0.65
Bits
ADC Total Unadjusted Error
(Note 5)
ADC ERR
MON_ range set to ‘01’ in r0Fh–r11h
0.75
%FSR
MON_ range set to ‘10’ in r0Fh–r11h
0.95
ADC Integral Nonlinearity
ADC Differential Nonlinearity
ADC INL
ADC DNL
0.8
0.8
LSB
LSB
ADC Total Monitoring Cycle Time
MON_ Input Impedance
t CYCLE
R IN
MAX16046, all channels monitored,
no MON_ fault detected (Note 6)
MON1–MON4
MON5–MON12
46
65
80
100
100
140
μs
k Ω
MON_ range set to ‘00’ in r0Fh–r11h
5.6
ADC MON_ Ranges
ADC RNG
MON_ range set to ‘01’ in r0Fh–r11h
2.8
V
Maxim Integrated
MON_ range set to ‘10’ in r0Fh–r11h
1.4
3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX16046ETN+ | 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16046ETN+CK4 | 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16046ETN+CK9 | 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16046ETN+T | 功能描述:监控电路 12Ch EEPROM Prob System Manager RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX16046EVKIT+ | 功能描述:电源管理IC开发工具 MAX16046 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
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