参数资料
型号: MAX16050
厂商: Maxim Integrated Products, Inc.
英文描述: Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability
中文描述: 电压监测器/排序电路,可反向排序
文件页数: 17/22页
文件大小: 322K
代理商: MAX16050
M
Daisy-Chaining the MAX16050/MAX16051
The MAX16050/MAX16051 can be daisy-chained to
sequence and monitor a large number of voltages
(Figure 7). When a fault occurs on any of the monitored
inputs,
FAULT
goes low, signaling a fast power-down.
Connect all
FAULT
pins of the MAX16050/MAX16051
together to ensure that all power supplies are turned off
during a fault.
In Figure 7,
SHDN
is pulled low to initiate the power-
down sequence. When all of the supply voltages moni-
tored by U2 are off, the bus removal output (REM) goes
high, thereby allowing U1 to start sequencing down.
REM normally is at a logic-low state when all voltages
are good. Connect U2’s REM to U1’s
EN_HOLD
to
force U1 to stay on even if EN and
SHDN
are pulled
low. This enable-and-hold circuitry allows the system to
power down correctly.
MOSFET Selection
The external pass MOSFET connects in series with the
sequenced power-supply source. Since the load cur-
rent and the MOSFET drain-to-source impedance
(R
DSON
) determine the voltage drop, the on-character-
istics of the MOSFET affect the load supply accuracy.
For highest supply accuracy and lowest voltage drop,
select a MOSFET with an appropriate drain-to-source
on-resistance with a gate-to-source bias of 4.5V to 6.0V
(see Table 2).
Layout and Bypassing
For better noise immunity, bypass V
CC
to GND with a
0.1μF capacitor installed as close to the device as pos-
sible. Bypass ABP to GND with a 1μF capacitor
installed as close to the device as possible; ABP is an
internally generated voltage and must not be used to
supply more than 1mA to external circuitry. Connect the
exposed pad (EP) to the ground plane for improved
heat dissipation. Do not use EP as the only ground con-
nection for the device.
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
______________________________________________________________________________________
17
MANUFACTURER
PART
V
DS
(V)
V
GSth
(V)
R
DSON
AT V
GS
= 4.5V
(m
Ω
)
I
MAX
AT 50mV
VOLTAGE DROP (A)
Qg (nC)
(TYP)
FOOTPRINT
FDC633N
30
0.67
42
1.19
11
Super
SOT
TM
-6
FDP8030L
FDB8030L
30
1.5
4.5
11.11
120
TO-220
TO-263AB
FDD6672A
30
1.2
9.5
5.26
33
TO-252
Fairchild
FDS8876
30
2.5
(max)
17
2.94
15
SO-8
Si7136DP
20
3
4.5
11.11
24.5
SO-8
Si4872DY
30
1
10
5
27
SO-8
SUD50N02-09P
20
3
17
2.94
10.5
TO-252
Vishay
Si1488DH
20
0.95
49
1.02
6
SOT-363
SC70-6
IRL3716
20
3
4.8
10.4
53
TO220AB
D
2
PAK
TO-262
IRL3402
20
0.7
10
5
78 (max)
TO-220AB
IRL3715Z
20
2.1
15.5
3.22
7
TO220AB
D
2
PAK
TO-262
International
Rectifier
IRLML2502
20
1.2
45
1.11
8
SOT23-3
Micro3
TM
Table 2. Recommended MOSFETs
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MAX16050ETI+ 功能描述:监控电路 Volt Mtr/Sequencer w/Reverse-Seq RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16050ETI+T 功能描述:监控电路 Volt Mtr/Sequencer w/Reverse-Seq RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16050EVKIT+ 功能描述:电源管理IC开发工具 MAX16050 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
MAX16051ETI+ 功能描述:监控电路 Volt Mtr/Sequencer w/Reverse-Seq RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel
MAX16051ETI+T 功能描述:监控电路 Volt Mtr/Sequencer w/Reverse-Seq RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟(典型值):10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel