参数资料
型号: MAX16050
厂商: Maxim Integrated Products, Inc.
英文描述: Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability
中文描述: 电压监测器/排序电路,可反向排序
文件页数: 2/22页
文件大小: 322K
代理商: MAX16050
M
Voltage Monitors/Sequencer Circuits with
Reverse-Sequencing Capability
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
CC
.........................................................................-0.3V to +30V
REM, OUT_, DISC_.................................................-0.3V to +30V
RESET
,
SHDN
, SET_,
FAULT
,
EN_HOLD
, EN, DELAY,
OV_OUT
, ABP, TIMEOUT, SEQ_...........................-0.3V to +6V
CP_OUT.........................................................-0.3V to (V
CC
+ 6V)
RESET
Current....................................................................50mA
DISC_ Current...................................................................180mA
Input/Output Current (all other pins)...................................20mA
ELECTRICAL CHARACTERISTICS
(V
CC
= 2.7V to 13.2V, V
EN
= V
ABP
, T
A
= T
J
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70°C)
28-Pin (4mm x 4mm) Thin QFN (derate 28.6mW/°C
above +70°C) ............................................................2285mW*
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
*As per JEDEC51 Standard (Multilayer Board).
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Voltage Range
(Note 2)
V
CC
Voltage on V
CC
to ensure the device is fully
operational
2.7
13.2
V
Operating Voltage
V
CCR
V
DISC_
= V
OUT_
= V
RESET
= low, voltage on
V
CC
rising
1.8
V
Regulated Supply Voltage
V
ABP
I
ABP
= 1mA (external sourcing current from
ABP)
2.45
2.90
V
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Supply Current
MONITORED ANALOG INPUTS
SET_ Threshold
SET_ Threshold Hysteresis
SET1–SET4 Input Current
SET5 Input Current
SET_ Threshold Tempco
Overvoltage Threshold
Overvoltage Threshold Hysteresis
EN Threshold
EN Threshold Hysteresis
EN Input Current
SEQUENCING, CAPACITOR DISCHARGE, AND SEQUENCE TIMING OUTPUTS
V
UVLO
V
UVLO_HYS
ABP falling
I
CC
Minimum voltage on ABP, ABP rising
2.1
2.3
100
0.7
V
mV
mA
V
CC
= 3.3V, all OUT_ = high, no load
1.1
V
TH
SET_ falling
SET_ rising
V
SET_
= 0.5V
V
SET5
= 0.5V (MAX16051 only)
0.492
0.5
0.5
0.508
V
V
TH_HYS
I
SET
I
SET5
Δ
V
TH/_TC
V
TH_OV
%V
TH
nA
μA
ppm/°C
V
%V
TH_OV
V
%V
TH_EN
nA
-100
-30
+100
+30
30
0.55
0.5
0.5
0.5
SET_ falling
SET_ rising
EN_ falling
EN_ rising
V
EN
= 0.5V
0.541
0.558
V
TH_EN
V
EN_HYS
I
EN
0.492
0.508
-100
+100
V
CC
= 3.3V, I
SINK
= 3.2mA
V
CC
= 1.8V, I
SINK
= 100μA
V
OUT_
= 12V, OUT_ asserted
Pulldown current during fault condition or
power-down mode, V
DISC_
= 1V
V
DISC_
= 3.3V, not in power-down mode
DISC_ falling
0.3
0.3
1
OUT_ Output Low Voltage
V
OL_OUT
V
OUT_ Leakage Current
I
LKG_OUT
μA
DISC_ Output Pulldown Current
I
OL_DISC
85
mA
DISC_ Output Leakage Current
DISC_ Power Low Threshold
I
LKG_DISC
V
TH_PL
1
μA
mV
200
250
300
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