参数资料
型号: MAX16909RATE/V+
厂商: Maxim Integrated Products
文件页数: 16/18页
文件大小: 0K
描述: IC REG BUCK 5V/ADJ 3A 16TQFN
标准包装: 60
类型: 降压(降压)
输出类型: 两者兼有
输出数: 1
输出电压: 5V,1 V ~ 10 V
输入电压: 3.5 V ~ 36 V
PWM 型: 电流模式
频率 - 开关: 220kHz ~ 1MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: *
封装/外壳: *
包装: *
供应商设备封装: *
MAX16909
36V, 220kHz to 1MHz Step-Down Converter
with Low Operating Current
V BAT
C 1
47μF
C 2
4.7μF
C 3
4.7μF
C 4
0.1μF
C 5
0.1μF
C COMP1
821pF
R COMP
9.1k I
C COMP2
12pF
R FOSC
62k I
SUP
EN
FSYNC
COMP
FOSC
MAX16909
SUPSW
BST
LX
OUT
FB
C BST
0.1μF
V OUT
R 1
80.6k I
R 2
100k I
L1
15μH
D1
V BIAS
R PGOOD
10k I
V OUT
1.8V AT 3A
C OUT
100μF
C BIAS
1μF
BIAS
GND
PGOOD
POWER GOOD
Figure 4. 1.8V/3A Configuration
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. Use a multilayer
board whenever possible for better noise immunity and
power dissipation. Follow these guidelines for good PCB
layout:
1) Use a large contiguous copper plane under the IC
package. Ensure that all heat-dissipating components
have adequate cooling. The bottom pad of the device
must be soldered down to this copper plane for effec-
tive heat dissipation and for getting the full power out
of the IC. Use multiple vias or a single large via in this
plane for heat dissipation.
2) Isolate the power components and high-current path
from the sensitive analog circuitry. This is essential to
prevent any noise coupling into the analog signals.
Maxim Integrated
3) Keep the high-current paths short, especially at the
ground terminals. This practice is essential for stable,
jitter-free operation. The high-current path composed
of input capacitor, high-side FET, inductor, and output
capacitor should be as short as possible.
4) Keep the power traces and load connections short.
This practice is essential for high efficiency. Use
thick copper PCBs (2oz vs. 1oz) to enhance full-load
efficiency.
5) The analog signal lines should be routed away from
the high-frequency planes. This ensures integrity of
sensitive signals feeding back into the IC.
6) The ground connection for the analog and power
section should be close to the IC. This keeps the
ground current loops to a minimum. In cases where
only one ground is used, enough isolation between
analog return signals and high-power signals must
be maintained.
16
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