参数资料
型号: MAX1708EEE+T
厂商: Maxim Integrated Products
文件页数: 13/14页
文件大小: 0K
描述: IC REG BST 3.3V/5V/ADJ 5A 16QSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 升压(升压)
输出类型: 两者兼有
输出数: 1
输出电压: 3.3V,5V,可调
输入电压: 0.7 V ~ 5 V
PWM 型: 电流模式
频率 - 开关: 600kHz
电流 - 输出: 5A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
包装: 带卷 (TR)
供应商设备封装: 16-QSOP
High-Frequency, High-Power, Low-Noise,
Step-Up DC-DC Converter
Layout Considerations
Due to high inductor current levels and fast switching
waveforms, proper PC board layout is essential. Protect
sensitive analog grounds by using a star ground config-
uration. Connect PGND, the input bypass capacitor
ground lead, and the output filter capacitor ground lead
to a single point (star ground configuration). In addition,
minimize trace lengths to reduce stray capacitance and
trace resistance, especially from the LX pins to the catch
diode (D1) and output capacitor (C2) to PGND pins. If an
external resistor-divider is used to set the output voltage
___________________ Chip Information
SUBSTRATE: GND
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages . Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
(Figure 4), the trace from FB to the resistors must be
extremely short and must be shielded from switching
signals, such as CLK or LX. To optimize package power
PACKAGE
TYPE
16 QSOP
PACKAGE
CODE
E16+1
OUTLINE
NO.
LAND
PATTERN NO.
dissipation and minimize device heating under heavy
loads, expand PC trace area connected to the three
PGND pins as much as the layout can allow. This is best
accomplished with a large PGND plane on the surface of
the board. Also note that outer-layer ground plane area
beneath the device provides little heat-sinking benefit. If
an outer-layer ground plane is not feasible, the PGND
pins should be connected to the inner-layer ground
plane with multiple vias (at least three vias per pin is rec-
ommended). Since the purpose of these vias is to opti-
mize thermal conductivity to the inner ground plane, be
sure that the vias have no gaps in their connections to
the ground plane. Refer to a layout example in the
MAX1708EVKIT data sheet.
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13
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相关代理商/技术参数
参数描述
MAX1708EVKIT 功能描述:直流/直流开关转换器 Evaluation Kit for the MAX1708 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX1708EVKIT+ 功能描述:直流/直流开关转换器 High-Frequency High-Power Low-Noise Step-Up DC-DC Converter RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX17094AETM+ 制造商:Maxim Integrated Products 功能描述:5GHZ 4-CHANNEL MIMO TRANSMITTER - Rail/Tube
MAX17094ETM+ 功能描述:电流和电力监控器、调节器 Boost Regulator w/7Ch Driver RoHS:否 制造商:STMicroelectronics 产品:Current Regulators 电源电压-最大:48 V 电源电压-最小:5.5 V 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:HPSO-8 封装:Reel
MAX17094ETM+T 功能描述:电流和电力监控器、调节器 Boost Regulator w/7Ch Driver RoHS:否 制造商:STMicroelectronics 产品:Current Regulators 电源电压-最大:48 V 电源电压-最小:5.5 V 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:HPSO-8 封装:Reel