参数资料
型号: MAX17149ETE+T
厂商: Maxim Integrated
文件页数: 10/21页
文件大小: 0K
描述: IC LED DRVR 6CH STEP UP 16QFN
标准包装: 2,500
系列: Quick-PWM™
拓扑: 开路漏极,PWM,升压(升压)
输出数: 6
内部驱动器:
类型 - 主要: 车载,背光
类型 - 次要: 白色 LED
频率: 可调节/可选择
电源电压: 3 V ~ 26 V
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-TQFN(3x3)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
Low-Cost, 6-String WLED Drivers with
Quick-PWM Step-Up Converter
Pin Description (contineud)
10
PIN
10
11
12
13
14
15
16
NAME
FB3
FB4
FB5
FB6
GND
ISET
EN
EP
FUNCTION
Current-Balancer Output. LED string cathode connection. FB3 is the open-drain output of an internal
regulator, which controls current through FB3. FB3 can sink up to 45mA. If unused, connect FB3 to
GND or leave high impedance.
Current-Balancer Output. LED string cathode connection. FB4 is the open-drain output of an internal
regulator, which controls current through FB4. FB4 can sink up to 45mA. If unused, connect FB4 to
GND or leave high impedance.
Current-Balancer Output. LED string cathode connection. FB5 is the open-drain output of an internal
regulator, which controls current through FB5. FB5 can sink up to 45mA. If unused, connect FB5 to
GND or leave high impedance.
Current-Balancer Output. LED string cathode connection. FB6 is the open-drain output of an internal
regulator, which controls current through FB6. FB6 can sink up to 45mA. If unused, connect FB6 to
GND or leave high impedance.
Analog Ground. Connect to ISET resistor ground as close as possible.
Full-Scale LED Current Adjustment Pin. The resistance from ISET to GND controls the full-scale current
in each LED string:
I LED_FS = 20mA O 100k I /R ISET
The acceptable resistance range is 44.44k I < R ISET < 200k I , which corresponds to full-scale LED
current of 45mA > I LED_FS > 10mA.
Enable and Dimming Mode Selection Input. Pull EN higher than 2.1V to enable the device, and lower
than 0.8V to disable the device. When V EN is higher than 2.1V, direct PWM mode is selected; when V EN
is between 1.4V and 1.8V, hybrid dimming mode is selected. While selecting hybrid dimming mode, the
device first needs to be enabled.
Exposed Backside Pad. Solder to the circuit board ground plane with sufficient copper connection to
ensure low thermal resistance. See the PCB Layout Guidelines section.
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