参数资料
型号: MAX1760HETB+T
厂商: Maxim Integrated Products
文件页数: 11/14页
文件大小: 0K
描述: IC REG BST SYNC 3.3V/ADJ 10TDFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 升压(升压)
输出类型: 两者兼有
输出数: 1
输出电压: 3.3V,2.5 V ~ 5.5 V
输入电压: 0.7 V ~ 5.5 V
PWM 型: 混合物
频率 - 开关: 1MHz
电流 - 输出: 800mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 10-TDFN-EP(3x3)
0.8A, Low-Noise, 1MHz,
Step-Up DC-DC Converter
age, and output capacitors with working voltage ratings
higher than the output.
The input filter capacitor reduces peak currents drawn
from the input source and also reduces input switching
noise. The input voltage source impedance determines
the required value of the input capacitor. When operat-
ing directly from one or two NiMH cells placed close to
the MAX1760, use a single 33μF low-ESR input filter
capacitor. With higher impedance batteries, such as
alkaline and Li+, a higher value input capacitor may
improve efficiency.
The output filter capacitor reduces output ripple voltage
and provides the load with transient peak currents
when necessary. For the output, a 100μF, low-equiva-
lent-series-resistance (ESR) capacitor is recommended
for most applications.
Sanyo POSCAP, Panasonic SP/CB, and Kemet T510
are good low-ESR capacitors. Low-ESR tantalum
capacitors offer a good tradeoff between price and
performance. Do not exceed the ripple current ratings
of tantalum capacitors. Avoid aluminum electrolytic
capacitors; their high ESR typically results in higher
output ripple voltage.
Other External Components
Two ceramic bypass capacitors are required for proper
operation. Bypass REF to GND with 0.22μF. Also,
bypass OUT to GND with a 0.68μF ceramic capacitor,
and connect OUT to POUT with a 4.7 ? resistor. Each of
these components should be placed as close to its
respective IC pins as possible, within 0.2in (5mm).
Table 4 lists suggested suppliers.
Layout Considerations
High switching frequencies and large peak currents
make PCB layout a critical part of design. Poor design
causes excessive EMI and ground bounce, both of
which can cause instability or regulation errors by cor-
rupting the voltage and current feedback signals.
Power components—such as the inductor, converter IC,
filter capacitors, and output diode—should be placed
as close together as possible, and their traces should
be kept short, direct, and wide. Keep the voltage feed-
back network very close to the IC, within 0.2in (5mm) of
the FB pin. Keep noisy traces, such as those from the
LX pin, away from the voltage feedback network and
guarded from them using grounded copper. Refer to the
MAX1760 evaluation kit for a full PCB example.
Chip Information
TRANSISTOR COUNT: 1361
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11
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