参数资料
型号: MAX1763EEE+T
厂商: Maxim Integrated Products
文件页数: 14/18页
文件大小: 0K
描述: IC REG BST SYNC 3.3V/ADJ 16QSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 升压(升压)
输出类型: 两者兼有
输出数: 1
输出电压: 3.3V,2.5 V ~ 5.5 V
输入电压: 0.7 V ~ 5.5 V
PWM 型: 混合物
频率 - 开关: 1MHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
包装: 带卷 (TR)
供应商设备封装: 16-QSOP
1.5A, Low-Noise, 1MHz, Step-Up
DC-DC Converter
Bypass Components
A few ceramic bypass capacitors are required for prop-
er operation. Bypass REF to GND with 0.22μF. Also,
bypass OUT to GND with a 1μF ceramic capacitor, and
connect OUT to POUT with a 4.7 Ω resistor. Each of
these components should be placed as close to their
respective IC pins as possible, within 0.2in (5mm).
Table 5 lists suggested suppliers.
Layout Considerations
High switching frequencies and large peak currents
make PC board layout a critical part of design. Poor
design will cause excessive EMI and ground bounce,
both of which can cause instability or regulation errors
by corrupting the voltage and current feedback signals.
Power components, such as the inductor, converter IC,
and filter capacitors, should be placed as close together
as possible, and their traces should be kept short, direct,
and wide. Keep the voltage feedback network very close
to the IC, within 0.2in (5mm) of the FB pins. Keep noisy
traces, such as those from the LX pin, away from the
voltage feedback networks and guarded from them
using grounded copper. If an external rectifier is used,
its traces must be kept especially short and use an
absolute minimum of copper area to avoid excess
capacitance that can slow the operation of the on-chip
synchronous rectifier and actually reduce efficiency.
Refer to the MAX1763 EV kit for a full PC board example.
The MAX1763 TSSOP-EP package features an
exposed thermal pad on its underside. This pad lowers
the package’s thermal resistance by providing a direct
thermal heat path from the die to the PC board.
Additionally, the ground pin (GND) also channels heat.
Connect the exposed thermal pad and GND to circuit
ground by using a large pad or multiple vias to the
ground plane.
Step-Up/Step-Down Applications
In some battery-powered applications, the battery volt-
age range overlaps the output voltage. In this case,
depending on the battery voltage, the regulator will
have to step the voltage up or down. To make a step-
up/step-down regulator, use the gain block to make a
linear regulator that follows the step-up converter. In
this case, if the battery voltage is low, then the circuit
will step up, and when the battery voltage is high, the
linear regulator will drop the voltage. See the Gain
Block section on how to use the gain block to make a
linear regulator. When the output voltage is greater than
the regulation voltage, then the synchronous rectifier
will be held on, reducing the dropout, and thus increas-
ing the efficiency when the battery voltage is close to,
but slightly above, the regulation voltage.
Chip Information
SUBSTRATE CONNECTED TO GND
14
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MAX1763EUE 功能描述:直流/直流开关转换器 1.5A Low-Noise 1MHz Step-Up RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX1763EUE+ 功能描述:直流/直流开关转换器 1.5A Low-Noise 1MHz Step-Up RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX1763EUE+T 功能描述:直流/直流开关转换器 1.5A Low-Noise 1MHz Step-Up RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT
MAX1763EUE+TG069 制造商:Maxim Integrated Products 功能描述:
MAX1763EUE-T 功能描述:直流/直流开关转换器 1.5A Low-Noise 1MHz Step-Up RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT