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| 型号： | MAX19995EVKIT# |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/23页 |
| 文件大小： | 0K |
| 描述： | EVALUATION KIT FOR MAX19995 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 类型： | 混频器，降频 |
| 频率： | 1.7GHz ~ 2.2GHz |
| 适用于相关产品： | MAX19996A |
Dual, SiGe, High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
LO1, LO2 to GND ..................................................-0.3V to +0.3V
LOSEL to GND ...........................................-0.3V to (V CC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
through a balun)..............................................................50mA
θ JA (Notes 2, 3)..............................................................+38°C/W
θ JC (Notes 1, 3)...............................................................7.4°C/W
Operating Case Temperature Range (Note 4) ....-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (Note 1) ...............................8.7W
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 4.75V to 5.25V, no input AC signals. T C = -40°C to +85°C, R1 = R4 = 681 Ω , R2 = R5 = 1.5k Ω .
Typical values are at V CC = 5.0V, T C = +25°C, unless otherwise noted. All parameters are production tested.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current, V CC = 5.0V
4.75
5
350
5.25
410
V
mA
LOSEL Input High Voltage
LOSEL Input Low Voltage
V IH
V IL
2
0.8
V
V
LOSEL Input Current
I IH and I IL
-10
+10
μA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = 3.0V to 3.6V, no input AC signals. T C = -40°C to +85°C, R1 = R4 = 909 Ω , R2 = R5 = 1k Ω . Typical
values are at V CC = 3.3V, T C = +25°C, unless otherwise noted. Parameters are guaranteed by design and not production tested.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
V CC
I CC
V IH
V IL
Total supply current
3.0
3.3
242
2
0.8
3.6
300
V
mA
V
V
2
_______________________________________________________________________________________
相关PDF资料 |
PDF描述 |
|---|---|
| MAX19996AEVKIT# | EVALUATION KIT FOR MAX19996A |
| MAX19996ETP+T | IC MIXER DOWNCONV 20-TQFN-EP |
| MAX19997AETX+T | IC DOWNCONVERTER 2CH 36TQFN |
| MAX19998ETP+ | IC MIXER DOWNCONVERSION 20TQFN |
| MAX19999ETX+T | IC DOWNCONVERTER 2CH 36TQFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX19995EVKIT# | 功能描述:射频开发工具 RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| MAX19996AETP+ | 功能描述:上下转换器 High-Gain 2GHz to 3.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19996AETP+T | 功能描述:上下转换器 High-Gain 2GHz to 3.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
| MAX19996AEVKIT# | 功能描述:射频开发工具 RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| MAX19996ETP+ | 功能描述:上下转换器 High-Gain 2GHz to 3.9GHz Downconv RoHS:否 制造商:Texas Instruments 产品:Down Converters 射频:52 MHz to 78 MHz 中频:300 MHz LO频率: 功率增益: P1dB: 工作电源电压:1.8 V, 3.3 V 工作电源电流:120 mA 最大功率耗散:1 W 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PQFP-128 |
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