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参数资料
| 型号： | MAX2031ETP+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | IC MIXER UP/DWN HI LIN 20-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 系列： | MAX2031 |
| RF 型： | 手机，CDMA2000，EDGE，GSM，W-CDMA |
| 频率： | 650MHz ~ 1GHz |
| 混频器数目： | 1 |
| 噪音数据： | 7dB |
| 次要属性： | 升/降频器 |
| 电流 - 电源： | 100mA |
| 电源电压： | 4.75 V ~ 5.25 V |
| 包装： | 带卷 (TR) |
| 封装/外壳： | 20-WQFN 裸露焊盘 |
| 供应商设备封装： | 20-TQFN-EP（5x5） |
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground-pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower-level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX2031 evaluation kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com .
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin with
the capacitors shown in the Typical Application Circuit.
See Table 1.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX2031’s 20-pin thin
QFN-EP package provides a low-thermal-resistance
path to the die. It is important that the PC board on
which the MAX2031 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with
a low-inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PC board,
either directly or through an array of plated via holes.
18
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相关代理商/技术参数 |
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|---|---|
| MAX2031EVKIT | 功能描述:射频混合器 RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2032 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:High-Linearity, 650MHz to 1000MHz Upconversion/Downconversion Mixer with LO Buffer/Switch |
| MAX2032ETP+ | 功能描述:射频混合器 .65GHz-1GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2032ETP+T | 功能描述:射频混合器 .65GHz-1GHz Up/Down Mixer RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| MAX2034 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Quad-Channel, Ultra-Low-Noise Amplifier with Digitally Programmable Input Impedance |
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