参数资料
型号: MAX2247EBC+T
厂商: Maxim Integrated
文件页数: 2/10页
文件大小: 0K
描述: IC AMP POWER 2.4GHZ 12-UCSP
标准包装: 2,500
频率: 2.4GHz ~ 2.5GHz
增益: 29dB
RF 型: ISM
电源电压: 2.7 V ~ 4.2 V
电流 - 电源: 350mA
封装/外壳: 12-WFBGA,WLCSP
包装: 带卷 (TR)
2.4GHz SiGe Linear Power Amplifier
ABSOLUTE MAXIMUM RATINGS
V CC 1, V CC 2, V CC B, RF_OUT to GND....................-0.3V to +4.5V
SHDN , BIAS, PD_OUT ................................-0.3V to V CC_ + 0.3V
RF Input Power (50 Ω source)...........................................+5dBm
RF_IN Input Current............................................................±1mA
Maximum VSWR Without Damage ........................................10:1
Maximum VSWR for Stable Operation, P OUT < +25dBm........5:1
Continuous Power Dissipation (T A = +70°C)
4 ? 3 UCSP, 12 WLP
(derate 28.5mW/°C above +70°C) ..................................1.3W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +125°C
UCSP Bump Temperature (soldering) (Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
WLP Bump Soldering Temperature .................................+250°C
Continuous Operating Lifetime.....................10yrs × 0.92 (T A - 60°C)
(For Operating Temperature, T A ≥ +60°C)
Thermal Resistance (Note 1)............................................35°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not recommended.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, V CC_ = +2.7V to +4.2V, SHDN = V CC , RF_IN and RF_OUT terminated to 50 Ω , T A = -40°C to +85°C. Typical values
are at +3V and T A = +25°C, unless otherwise noted.) (Note 3)
PARAMETER
Supply Voltage
Supply Current (Notes 4, 5)
CONDITIONS
P OUT = +24dBm, V CC_ = 3.3V
Idle current = 250mA
P OUT = +25dBm, V CC_ = 4.2V
with V CC = 3.3V
P OUT = +23dBm, V CC_ = 3.0V
P OUT = +21dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
MIN
2.7
TYP
317
345
305
175
MAX
4.2
350
UNITS
V
mA
P OUT = +18dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
P OUT = +15dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
120
85
Shutdown Supply Current
SHDN = 0, no RF signal applied
0.5
10
μA
Digital Input Logic High
Digital Input Logic Low
2
0.8
V
V
Digital Input Current High
Digital Input Current Low
-1
-1
+5
+1
μA
μA
2
_______________________________________________________________________________________
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