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参数资料
| 型号： | MAX2247EBC+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 9/10页 |
| 文件大小： | 0K |
| 描述： | IC AMP POWER 2.4GHZ 12-UCSP |
| 标准包装： | 2,500 |
| 频率： | 2.4GHz ~ 2.5GHz |
| 增益： | 29dB |
| RF 型： | ISM |
| 电源电压： | 2.7 V ~ 4.2 V |
| 电流 - 电源： | 350mA |
| 封装/外壳： | 12-WFBGA，WLCSP |
| 包装： | 带卷 (TR) |
2.4GHz SiGe Linear Power Amplifier
Ground Vias
To achieve optimum gain, output power, thermal perfor-
mance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
UCSP Reliability
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is inte-
grally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reli-
ably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific lim-
itations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
Chip Information
TRANSISTOR COUNT: 1425
consideration for a UCSP. UCSP solder-joint contact
Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages .
PACKAGE TYPE
4 x 3 UCSP
12 WLP
PACKAGE CODE
B12-8
W121B2+2
DOCUMENT NO.
21-0104
21-0009
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX2247EBC-T10 | 功能描述:射频放大器 2.4GHz SiGe Linear Power Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX2247EVKIT | 功能描述:放大器 IC 开发工具 MAX2247 Eval Kit RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V |
| MAX2247EWC+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX2247EWC+T | 功能描述:射频放大器 2.4GHz SiGe Linear Power Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| MAX225 | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:+5V-Powered, Multichannel RS-232 Drivers/Receivers |
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