参数资料
| 型号： | MAX256ASA+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/14页 |
| 文件大小： | 0K |
| 描述： | IC DRVR H-BRIDGE 8-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 半桥 |
| 输入类型： | 非反相 |
| 输出数： | 2 |
| 导通状态电阻： | 500 毫欧 |
| 电流 - 输出 / 通道： | 600mA |
| 电流 - 峰值输出： | 1A |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm Width）裸露焊盘 |
| 供应商设备封装： | 8-SOICN 裸露焊盘 |
| 包装： | 带卷 (TR) |
3W Primary-Side Transformer H-Bridge Driver
for Isolated Supplies
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
Supply Voltage V CC ..................................................-0.3V to +6V
ST1, ST2, CK_RS, MODE (Note 1)................-0.3V to V CC + 0.3V
ST1, ST2 Maximum Continuous Current (T A < +125°C) ....±0.6A
ST1, ST2 Maximum Continuous Current (T A < +100°C) ....±0.9A
ST1, ST2 Maximum Continuous Current (T A < +85°C) ......±1.0A
Continuous Power Dissipation (T A = +70°C)
8-Pin SO (derate 18.9mW/°C above +70°C)..............1509mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: ST1 and ST2 are not protected against short circuits. Damage to the device may result from a short-circuit fault.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SO-EP
Junction-to-Ambient Thermal Resistance ( θ JA )...............53°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................5°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
DC ELECTRICAL CHARACTERISTICS
(V CC = +3.0V to +5.5V, T A = T MIN to T MAX . Typical values are at V CC = +5.0V and T A = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Disable Supply Current
SYMBOL
V CC
I CC
I SD
CONDITIONS
MODE = V CC, CK_RS unconnected (Note 3)
MODE = GND,
CK_RS unconnected
MIN
3.0
TYP
1.06
MAX
5.5
3
50
UNITS
V
mA
μA
External Resistance Range
R S
10
k ?
Driver Total Resistance
R OHL
V CC = 4.5V (Note 4)
V CC = 3.0V (Note 4)
0.5
0.6
1.0
1.2
?
Undervoltage Lockout Threshold
V UVLO
V CC rising
0.8
1.9
2.7
V
Undervoltage-Lockout-Threshold
Hysteresis
V UVLO_HST
110
mV
Logic-Low Level
(MODE, CK_RS)
Logic-High Level
(MODE, CK_RS)
Input Leakage Current
(MODE)
Internal Pulldown Resistance on
CK_RS
Thermal Shutdown
Thermal Shutdown Hysteresis
V IL
V IH
I LK
R S_INT
T SHDN
T SHDN_HST
V CC = 4.5V
V CC = 3.0V
MODE = GND
2.0
165
165
10
0.8
0.7
1
V
V
μA
k ?
°C
°C
2
_______________________________________________________________________________________
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