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参数资料
| 型号： | MAX3023EUD+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/18页 |
| 文件大小： | 0K |
| 描述： | IC TRANSLATOR LVL 100MBPS 14TSSO |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 96 |
| 逻辑功能： | 变换器，双向，3 态 |
| 位数： | 4 |
| 输入类型： | 逻辑 |
| 输出类型： | 逻辑 |
| 数据速率： | 100Mbps |
| 通道数： | 4 |
| 输出/通道数目： | 1 |
| 差分 - 输入:输出： | 无/无 |
| 传输延迟（最大）： | 6ns |
| 电源电压： | 1.65 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 管件 |
MAX13013/MAX13014/MAX3023
+1.2V to +3.6V, 0.1A, 100Mbps,
Single-/Dual-/Quad-Level Translators
______________________________________________________________________________________
11
Figure 6 shows a graph of typical input current versus
input voltage.
Output Load Requirements
The MAX13013/MAX13014/MAX3023 I/O are designed to
drive CMOS inputs. Do not load the I/O lines with a resis-
tive load less than 25k
Ω. Also, do not place an RC circuit
at the input of these devices to slow down the edges. If a
slower rise/fall time is required, refer to the
MAX3000E/MAX3001E logic-level-translators data sheet.
For I2C level translation, refer to the MAX3372E-
MAX3379E/MAX3390E–MAX3393E data sheet.
Enable Inputs
The MAX13013 single-, the MAX13014 dual- and the
MAX3023 (UCSP package) quad-level translators feature
an EN input. The MAX3023 (TSSOP package) quad-level
translator features both EN and EN inputs (see Table 2
for operating mode). Note that the MAX3023 (TSSOP
package) has internal pullup and pulldown circuitry on
EN and EN, respectively. If left unconnected, EN is pulled
up to VL and EN is pulled down to GND.
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of introducing data
errors, bypass VL and VCC to ground with a 0.1F
ceramic capacitor. Place all capacitors as close to the
power-supply inputs as possible.
Unidirectional vs. Bidirectional Level
Translator
The MAX13013/MAX13014/MAX3023 bidirectional
translators can operate as a unidirectional device to
translate signals without inversion. These devices pro-
vide the smallest solution (UCSP package) for unidirec-
tional level translation without inversion.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and recommended reflow tem-
perature profiles, as well as the latest information on
reliability testing results, go to Maxim’s web site at
www.maxim-ic.com/ucsp to find the Application Note:
UCSP—A Wafer-Level Chip-Scale Package.
Table 2. MAX3023 (TSSOP Package)
Operating Mode
EN
EN
OPERATING MODE
0
Both I/O VL_ and I/O VCC_ are in tri-state.
VL
0
Normal operation.
0VL
Both I/O VL_ and I/O VCC_ are in tri-state.
VL
Both I/O VL_ and I/O VCC_ are in tri-state.
VIN
VTH_IN / RIN*
-(VS - VTH_IN) /
RIN*
IIN
VS
WHERE VS = VCC OR VL
*RIN = 4k
Ω WHEN DRIVING VL SIDE; RIN = 150Ω WHEN DRIVING VCC SIDE.
0
VTH_IN
Figure 6. Typical IIN vs. VIN
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3023EUD+ | 功能描述:转换 - 电压电平 1.2-3.6V .1uA 100Mbps RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX3023EUD+T | 功能描述:转换 - 电压电平 1.2-3.6V .1uA 100Mbps RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX3023EUD-T | 功能描述:转换 - 电压电平 RoHS:否 制造商:Micrel 类型:CML/LVDS/LVPECL to LVCMOS/LVTTL 传播延迟时间:1.9 ns 电源电流:14 mA 电源电压-最大:3.6 V 电源电压-最小:3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MLF-8 |
| MAX3024EUD | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3025EUD | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
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