参数资料
型号: MAX3208EEUB+T
厂商: Maxim Integrated Products
文件页数: 3/9页
文件大小: 0K
描述: IC ESD PROT DIFF 10-UMAX
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
电极标记: 4 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-µMAX
包装: 带卷 (TR)
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
Typical Operating Characteristics
(V CC = +5V, T A = +25°C, unless otherwise noted.)
1.5
1.3
CLAMP VOLTAGE
vs. DC CURRENT
10,000
LEAKAGE CURRENT
vs. TEMPERATURE
4
INPUT CAPACITANCE
vs. INPUT VOLTAGE
1.1
0.9
I/O_ TO V CC
1000
100
3
2
0.7
0.5
0.3
GND TO I/O_
10
1
1
0
10
30
50
70
90
110
130
150
-40
0
40
80
120
0
1
2
3
4
5
DC CURRENT (mA)
TEMPERATURE ( ° C)
INPUT VOLTAGE (V)
Pin Description
PIN
MAX3205E
MAX3207E
MAX3208E
NAME
FUNCTION
TQFN-EP
WLP
SOT23
μMAX
TQFN-EP
4, 5, 7,
12, 13, 15
A2, A3, B1,
B3, C1, C2
1, 4
1, 4, 6, 9
4, 7, 12, 15
I/O_
ESD-Protected Channel
1, 3, 6, 8,
1, 3, 5, 6,
9, 11, 14,
3, 6
2, 5, 7, 10
8, 9, 11,
N.C.
No Connection. Not internally connected.
16
13, 14, 16
2
B2
A1
2
3
2
N.C.
GND
No Connection. The solder sphere is omitted from
this location (see the Package Information section).
Ground. Connect GND with a low-impedance
connection to the ground plane.
Power-Supply Input. Bypass V CC to GND with a
10
C3
5
8
10
V CC
0.1μF ceramic capacitor as close to the device as
possible.
EP
Exposed Pad (TQFN Only). Connect EP to GND.
_______________________________________________________________________________________
3
相关PDF资料
PDF描述
MTSW-116-22-S-D-440 CONN HEADER 32POS .100" TH DUAL
MAX3208EATE+T IC ESD PROT DIFF 16-TQFN
MAX3208EAUB+T IC ESD PROT DIFF 10-UMAX
3433-2603 CONN HEADER 50POS STR LONG LA
MAX3208EEUB+ IC ESD PROT DIFF 10-UMAX
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