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参数资料
| 型号： | MAX3208EEUB+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC ESD PROT DIFF 10-UMAX |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 电极标记： | 4 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-µMAX |
| 包装： | 带卷 (TR) |
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
Layout Recommendations
Proper circuit-board layout is critical to suppress ESD-
induced line transients (See Figure 6). The MAX3205E/
MAX3207E/MAX3208E clamp to 100V; however, with
improper layout, the voltage spike at the device can be
much higher. A lead inductance of 10nH with a 45A
current spike results in an additional 450V spike on the
protected line. It is essential that the layout of the PC
board follows these guidelines:
1) Minimize trace length between the connector or
input terminal, I/O_, and the protected signal line.
2) Use separate planes for power and ground to reduce
parasitic inductance and to reduce the impedance to
the power rails for shunted ESD current.
3) Ensure short low-inductance ESD transient return
paths to GND and V CC .
4) Minimize conductive power and ground loops.
5) Do not place critical signals near the edge of the PC
6) Bypass V CC to GND with a low-ESR ceramic capaci-
tor as close to V CC as possible.
7) Bypass the supply of the protected device to GND
with a low-ESR ceramic capacitor as close to the
supply pin as possible.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, refer to Application
Note 1891: Wafer-Level Packaging (WLP) and Its
Applications.
Chip Information
PROCESS: BiCMOS
board.
V CC
L2
Typical Operating Circuit
L1
I/0 LINE
I/0
PROTECTED LINE
V CC
I/0_
V CC
PROTECTED
CIRCUIT
NEGATIVE ESD-
CURRENT
PULSE
PATH TO
0.1 μ F
0.1 μ F
GROUND
D1
I/O_
V C
PROTECTED
D2
CIRCUIT
MAX3205E
MAX3207E
MAX3208E
GND
Figure 6. Layout Considerations
L3
_______________________________________________________________________________________
7
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PDF描述 |
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| MTSW-116-22-S-D-440 | CONN HEADER 32POS .100" TH DUAL |
| MAX3208EATE+T | IC ESD PROT DIFF 16-TQFN |
| MAX3208EAUB+T | IC ESD PROT DIFF 10-UMAX |
| 3433-2603 | CONN HEADER 50POS STR LONG LA |
| MAX3208EEUB+ | IC ESD PROT DIFF 10-UMAX |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3209ECUU | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3209ECUU+ | 功能描述:RS-232接口集成电路 12V 2Ch RS-232 Serial Port RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3209ECUU+T | 功能描述:RS-232接口集成电路 12V 2Ch RS-232 Serial Port RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3209ECUU-T | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
| MAX3209EEUU | 功能描述:RS-232接口集成电路 RoHS:否 制造商:Exar 数据速率:52 Mbps 工作电源电压:5 V 电源电流:300 mA 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:LQFP-100 封装: |
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