参数资料
| 型号： | MAX3273ETG+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 12/18页 |
| 文件大小： | 0K |
| 描述： | IC LASR DRVR 2.7GBPS 3.6V 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 激光二极管驱动器（光纤） |
| 数据速率： | 2.7Gbps |
| 通道数： | 1 |
| 电源电压： | 3.14 V ~ 3.6 V |
| 电流 - 电源： | 30mA |
| 电流 - 调制： | 60mA |
| 电流 - 偏置： | 100mA |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
+3.3V, 2.5Gbps Low-Power Laser Driver
Interface Models
Figures 4 and 5 show simplified input and output cir-
cuits for the MAX3273 laser driver. If dice are used,
replace package parasitic elements with bondwire par-
asitic elements.
Wire-Bonding Die
For high-current density and reliable operation, the
MAX3273 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100μm) square, and die thickness is 14
mils (350μm).
Laser Safety and IEC 825
Using the MAX3273 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections
must be considered. Customers must determine the
level of fault tolerance required by their application,
recognizing that Maxim products are not designed or
authorized for use as components in systems intended
for surgical implant into the body, for applications
intended to support or sustain life, or for any other
application where the failure of a Maxim product could
create a situation where personal injury or death may
occur.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3273 output pins and laser diode as close as
possible. Optimize the laser-diode performance by
placing a bypass capacitor as close as possible to the
laser anode. Use good high-frequency layout tech-
niques and multilayer boards with uninterrupted ground
planes to minimize EMI and crosstalk.
TRANSISTOR COUNT: 1672
PROCESS: SiGe
ISOLATED SUBSTRATE
Chip Information
16k Ω
V CC
V CC
PACKAGE
PACKAGE
V CC
0.9nH
OUT+
IN+
0.9nH
0.1pF
0.1pF
5k Ω
0.9nH
OUT-
0.1pF
V CC
0.9nH
IN-
0.1pF
Figure 4. Simplified Input Circuit
5k Ω
24k Ω
Figure 5. Simplified Output Circuit
12
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3273EVKIT | 功能描述:激光驱动器 Evaluation Kit for the MAX3273 RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube |
| MAX3274UGE | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3277EVKIT | 制造商:Maxim Integrated Products 功能描述:LOW-NOISE, FIBRE CHANNEL TRANSIMPED - Boxed Product (Development Kits) |
| MAX3277U/D | 功能描述:特殊用途放大器 RoHS:否 制造商:Texas Instruments 通道数量:Single 共模抑制比（最小值）: 输入补偿电压: 工作电源电压:3 V to 5.5 V 电源电流:5 mA 最大功率耗散: 最大工作温度:+ 70 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-20 封装:Reel |
| MAX327C/D DIE | 制造商:Maxim Integrated Products 功能描述: |
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