参数资料
型号: MAX3346EEBE+T
厂商: Maxim Integrated Products
文件页数: 5/17页
文件大小: 0K
描述: IC USB TXRX ESD PROTECT 16-UCSP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 收发器
驱动器/接收器数: 1/1
规程: USB 2.0
电源电压: 4 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 16-WFBGA,CSPBGA
供应商设备封装: 16-UCSP(2x2)
包装: 带卷 (TR)
MAX3346E
±15kV ESD-Protected USB Transceiver
in UCSP
______________________________________________________________________________________
13
___________________________________________________________________________________________________
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3346E helps
to design equipment that meets Level 2 of IEC 1000-4-
2, without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 7a shows the IEC 1000-4-2 model.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just USB inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, go to the Maxim website at
www.maxim-ic.com/ucsp for the Application Note,
“UCSP—A Wafer-Level Chip-Scale Package.”
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50M to 100M
RD
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 7a. IEC 1000-4-2 ESD Test Model
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相关代理商/技术参数
参数描述
MAX3346EEUD 功能描述:USB 接口集成电路 RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20
MAX3346EEUD+ 功能描述:USB 接口集成电路 ESD-Protected USB Tcvr RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20
MAX3346EEUD+T 功能描述:USB 接口集成电路 ESD-Protected USB Tcvr RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20
MAX3346EEUD-T 功能描述:USB 接口集成电路 RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20
MAX3349EAEBE+ 制造商:Maxim Integrated Products 功能描述: