参数资料
| 型号： | MAX3735AETG+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 14/18页 |
| 文件大小： | 0K |
| 描述： | IC LSR DRVR 2.7GBPS 3.63V 24TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 激光二极管驱动器（光纤） |
| 数据速率： | 2.7Gbps |
| 通道数： | 1 |
| 电源电压： | 2.97 V ~ 3.63 V |
| 电流 - 电源： | 27mA |
| 电流 - 调制： | 85mA |
| 电流 - 偏置： | 100mA |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
2.7Gbps, Low-Power SFP Laser Drivers
Capacitors Used with MAX3735/MAX3735A SFP Module
Designs for more information on choosing C APC for DC-
and AC-coupled laser interfaces.
MAX3735
Use the following equation to find the C APC value when
using the MAX3735:
C APC = 4.04 × 10 -9 × t _on × η × ρ MON (29.3 + 20.6 I TH -
0.22 I TH 2 ) × (1947 + 833 I MOD - 7.78 I MOD 2 + 0.103
I MOD 3 )
where units are:
C APC in μF, I TH , and I MOD in mA and t ON in μs. C MD can
then be chosen as approximately 20x smaller than C APC
for the MAX3735.
MAX3735A
Use Table 4 to choose C APC when using the MAX3735A.
C APC should be chosen according to the highest gain of
the lasers (generally at cold temperature). C APC selec-
tion assumes a 34% reduction in the gain of the lasers at
+85°C from the cold (-40°C) values.
Table 4. MAX3735A CAPC Selection
isolates laser forward voltage from the output circuitry
and allows the output at OUT+ to swing above and
below the supply voltage (V CC ). When AC-coupled, the
MAX3735/MAX3735A modulation current can be pro-
grammed from 10mA to 85mA. Refer to Maxim
Application Note HFAN 02.0: Interfacing Maxim’s Laser
Drivers to Laser Diodes for more information on AC-
coupling laser drivers to laser diodes.
Interface Models
Figures 6 and 7 show simplified input and output cir-
cuits for the MAX3735/MAX3735A laser driver. If dice
are used, replace package parasitic elements with
bondwire parasitic elements.
Wire Bonding Die
The MAX3735 uses gold metalization with a thickness of
5μm (typ). Maxim characterized this circuit with gold wire
ball bonding (1-mil diameter wire). Die-pad size is 94 mil
(2388μm) square, and die thickness is 15 mil (381μm).
Refer to Maxim Application Note HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size for additional information.
Layout Considerations
LASER GAIN (A/A)
0.005
0.007
0.010
0.020
0.030
0.040
C APC (μF)
0.039
0.047
0.068
0.100
0.120
0.120
To minimize inductance, keep the connections between
the MAX3735 output pins and laser diode as close as
possible. Optimize the laser diode performance by
placing a bypass capacitor as close as possible to the
laser anode. Use good high-frequency layout tech-
niques and multiple-layer boards with uninterrupted
ground planes to minimize EMI and crosstalk.
Exposed-Pad Package
The exposed pad on the 24-pin QFN provides a very
where Gain = I MD /(I BIAS - I TH + 0.5 x I MOD ) for DC-cou-
pled lasers. C MD can then be chosen as approximately
4x to 20x smaller than C APC for the MAX3735A
Using the MAX3735/MAX3735A
with Digital Potentiometers
For more information on using the MAX3735/MAX3735A
with the Dallas DS1858/DS1859 SFP controller, refer to
Maxim Application Note HFAN 2.3.3: Optimizing the
Resolution of Laser Driver Setting Using Linear Digital
Potentiometers for more information.
Modulation Currents Exceeding 60mA
For applications requiring a modulation current greater
than 60mA, headroom is insufficient for proper opera-
tion of the laser driver if the laser is DC-coupled. To
avoid this problem, the MAX3735/MAX3735A’s modula-
tion output can be AC-coupled to the cathode of a laser
diode. An external pullup inductor is necessary to DC-
bias the modulation output at V CC . Such a configuration
low thermal resistance path for heat removal from the IC.
The pad is also electrical ground on the MAX3735/
MAX3735A and must be soldered to the circuit board
ground for proper thermal and electrical performance.
Refer to Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages for additional information.
Laser Safety and IEC 825
Using the MAX3735/MAX3735A laser driver alone does
not ensure that a transmitter design is compliant with IEC
825. The entire transmitter circuit and component selec-
tions must be considered. Each user must determine the
level of fault tolerance required by the application, recog-
nizing that Maxim products are neither designed nor
authorized for use as components in systems intended
for surgical implant into the body, for applications intend-
ed to support or sustain life, or for any other application
in which the failure of a Maxim product could create a
situation where personal injury or death may occur.
14
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PDF描述 |
|---|---|
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| MAX3737ETJ+T | IC LSR DRVR 2.7GBPS 3.63V 32TQFN |
| MAX3738ETG+T | IC LASER DRIVER 4.25GBPS 24TQFN |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX3735AEVKIT | 功能描述:激光驱动器 Evaluation Kit for the MAX3735A RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube |
| MAX3735E/D | 功能描述:激光驱动器 RoHS:否 制造商:Micrel 数据速率:4.25 Gbps 工作电源电压:3 V to 3.6 V 电源电流:80 mA 最大工作温度:+ 85 C 封装 / 箱体:QFN-16 封装:Tube |
| MAX3735EGG | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3735EGG-T | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX3735ETG | 制造商:Maxim Integrated Products 功能描述:2.7GBPS, LOW-POWER SFP LASER DRIVER - Rail/Tube |
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