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参数资料
| 型号： | MAX4294EUD+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 5/18页 |
| 文件大小： | 0K |
| 描述： | IC OP AMP R-R I/O 14-TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 放大器类型： | 通用 |
| 电路数： | 4 |
| 输出类型： | 满摆幅 |
| 转换速率： | 0.2 V/µs |
| 增益带宽积： | 500kHz |
| 电流 - 输入偏压： | 15nA |
| 电压 - 输入偏移： | 200µV |
| 电流 - 电源： | 100µA |
| 电流 - 输出 / 通道： | 20mA |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V，±0.9 V ~ 2.75 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 带卷 (TR) |
MAX4291/MAX4292/MAX4294
Ultra-Small, 1.8V, Power,
Rail-to-Rail I/O Op Amps
______________________________________________________________________________________
13
For a 1V output and a current load of 50mA, the choice
of resistors can be R1 = 2
, R2 = 100k, and R3 =
1M
.
UCSP Information
Layout Issues
Design the layout for the IC to be as compact as possi-
ble to minimize parasitics. The UCSP uses a bump
pitch of 0.5mm (19.7mil) and bump diameter of 0.3
(~12mil). Therefore, lay out the solder-pad spacing on
0.5mm (19.7mil) centers, using a pad size of 0.25mm
(~10mil) and a solder mask opening of 0.33mm (13mil).
Round or square pads are permissible. Connect multi-
ple vias from the ground plane as close to the ground
pins as possible.
Install capacitors as close as possible to the IC supply
voltage pin. Place the ground end of these capacitors
near the IC GND pins to provide a low-impedance
return path for the signal current.
Prototype Chip Installation
Alignment keys on the PC board, around the area
where the chip is located, will be helpful in the proto-
type assembly process. It is better to align the chip on
the board before any other components are placed,
and then place the board on a hot plate or hot surface
until the solder starts melting. Remove the board from
the hot plate without disturbing the position of the chip
and let it cool down to room temperature before pro-
cessing the board further.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user’s PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
Marking Information
R1
ILOAD
R2
VCC
VEE
R3
VOUT
Q1
MAX4291
Figure 11. Current Monitor for a 2-Cell Battery Stack
AAA
ORIENTATION
PRODUCT ID CODE
LOT CODE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX4295EEE | 功能描述:音频放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX4295EEE+ | 功能描述:音频放大器 Mono 2W Switch Mode (Class D) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX4295EEE+T | 功能描述:音频放大器 Mono 2W Switch Mode (Class D) RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX4295EEE-T | 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| MAX4295ESE | 功能描述:音频放大器 RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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