参数资料
型号: MAX44268EWL+T
厂商: Maxim Integrated Products
文件页数: 8/15页
文件大小: 0K
描述: IC COMPARATOR W/REF DUAL 9WLP
产品培训模块: Obsolescence Mitigation Program
标准包装: 2,500
类型: 通用
元件数: 2
输出类型: 开路漏极
电压 - 电源,单路/双路(±): 1.8 V ~ 5.5 V
电压 - 输入偏移(最小值): 5mV @ 5V
电流 - 输入偏压(最小值): 0.15nA
电流 - 输出(标准): 50mA
电流 - 静态(最大值): 1.15µA
CMRR, PSRR(标准): 80dB PSRR
传输延迟(最大): 39µs
磁滞: 6mV
工作温度: -40°C ~ 85°C
封装/外壳: 9-WFBGA,WLBGA
安装类型: 表面贴装
包装: 带卷 (TR)
Maxim Integrated Products 2
MAX44268
1.3mm x 1.3mm, Low-Power
Dual Comparator with Reference
VCC to GND.............................................................-0.3V to +6V
INA+, REF/INA-, INB+, INB- to GND ......................-0.3V to +6V
Output Voltage to GND (OUT_) ..............................-0.3V to +6V
Output Current (OUT_).................................................... Q50mA
Output Short-Circuit Duration (OUT_) .......................Continuous
Continuous Power Dissipation (TA = +70NC)
WLP (derate 11.9mW/NC above TA = +70NC).............952mW
Continuous Input Current into Any Pin............................ Q20mA
Operating Temperature Range.......................... -40NC to +85NC
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
WLP
Junction-to-Ambient Thermal Resistance (
qJA) ..........84°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VCC = 5V, VGND = 0V, VIN- = VIN+ = 1.236V, RPULLUP = 100kI to VCC, TA = -40NC to +85NC. Typical values are at TA = +25NC,
unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input-Referred Hysteresis
VHYS
(VGND - 0.2V) P VCM P (VCC + 0.2V) (Note 3)
4
6
mV
Input Offset Voltage
VOS
VGND - 0.2V P VCM P
VCC + 0.2V (Note 4)
TA = +25NC
0.15
5
mV
-40NC P TA P +85NC
10
Input Bias Current
IB
TA = +25NC
0.15
nA
TA = -40NC to +85NC
0.2
Output-Voltage Swing
Low
VOL
VCC = 1.8V,
ISINK = 1mA
TA = +25NC
105
200
mV
-40NC P TA P +85NC
300
VCC = 5V, ISINK =
6mA
TA = +25NC
285
350
-40NC P TA P +85NC
450
Input Voltage Range
VCM
Inferred from VOS test
VGND
- 0.2V
VCC
+ 0.2V
V
Output Short-Circuit
Current
ISC
Sinking, VOUT = VCC
VCC = 1.8V
3
mA
VCC = 5V
30
Output Leakage Current
ILEAK
VCC = 5.5V, VOUT = 5.5V
0.2
nA
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