参数资料
型号: MAX4950ACTX+T
厂商: Maxim Integrated Products
文件页数: 4/5页
文件大小: 0K
描述: IC PCIE REDRIVER DUAL 36-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 均衡器,转接驱动器
电源电压: 3.3V
安装类型: 表面贴装
封装/外壳: 36-WFQFN 裸露焊盘
供应商设备封装: 36-TQFN 裸露焊盘(6x6)
包装: 带卷 (TR)
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
MAX4950ACTX+
The results of the 150°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
=
1.83
(Chi square value for MTTF upper limit)
MTTF
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.4 x 10
-9
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-
ic.com/. Current monitor data for the G4 Process results in a FIT Rate of 0.32 @ 25C and 8.53 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The AJ60 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC
JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250 mA, 1.5x VCCMax Overvoltage per
JESD78.
Maxim Integrated Products. All rights reserved.
Page 4/5
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