- 您现在的位置：买卖IC网 > PDF目录1842 > MAX5060ATI+ (Maxim Integrated Products)IC REG CTRLR BUCK PWM CM 28-TQFN PDF资料下载
参数资料
| 型号： | MAX5060ATI+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 27/31页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM CM 28-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 60 |
| PWM 型： | 电流模式 |
| 输出数： | 1 |
| 频率 - 最大： | 1.5MHz |
| 占空比： | 90% |
| 电源电压： | 4.75 V ~ 28 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 28-WFQFN 裸露焊盘 |
| 包装： | 管件 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页当前第27页第28页第29页第30页第31页
0.6V to 5.5V Output, Parallelable,
Average-Current-Mode DC-DC Controllers
Use the following equation to calculate the resistor R CF :
PC Board Layout
R CF ≤
f SW × L × 10 2
V OUT × R S
Use the following guidelines to layout the switching
voltage regulator.
1) Place the IN, V CC , and V DD bypass capacitors
close to the MAX5060/MAX5061.
C CF provides a low-frequency pole while R CF provides
a midband zero. Place a zero (f Z ) to obtain a phase
bump at the crossover frequency. Place a high-fre-
quency pole (f P ) at least a decade away from the
crossover frequency to reduce the influence of the
switching noise and achieve maximum phase margin.
Use the following equations to calculate C CF and C CFF :
2) Minimize the area and length of the high-current
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to
the input capacitor negative terminal.
3) Keep short the current loop formed by the lower
switching MOSFET, inductor, and output capacitor.
4) Place the Schottky diodes close to the lower
C CF =
C CFF =
1
2 × π × f Z × R CF
1
2 × π × f P × R CF
MOSFETs and on the same side of the PC board.
5) Keep the SGND and PGND isolated and connect
them at one single point close to the negative termi-
nal of the input filter capacitor.
6) Run the current-sense lines CSP and CSN very
close to each other to minimize the loop area.
Power Dissipation
The TQFN-28 and TSSOP-16 are thermally enhanced
packages and can dissipate about 2.7W and 1.7W,
respectively. The high-power packages make the high-
frequency, high-current buck converter possible to
operate from a 12V or 24V bus. Calculate power dissi-
pation in the MAX5060/MAX5061 as a product of the
input voltage and the total V CC regulator output current
(I CC ). I CC includes quiescent current (I Q ) and gate-
drive current (I DD ):
P D = V IN x I CC
I CC = I Q + [f SW x (Q G1 + Q G2 )]
where Q G1 and Q G2 are the total gate charge of the
low-side and high-side external MOSFETs at V GATE =
5V, I Q is estimated from the Supply Current (I Q )
vs. Frequency graph in the Typical Operating
Characteristics , and f SW is the switching frequency of
the converter.
Use the following equation to calculate the maximum
power dissipation (P DMAX ) in the chip at a given ambi-
ent temperature (T A ) :
MAX5060:
P DMAX = 34.5 x (150 - T A )..............mW
MAX5061:
P DMAX = 21.3 x (150 - T A )..............mW
Similarly, run the remote voltage sense lines
SENSE+ and SENSE- close to each other. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
7) Avoid long traces between the V DD (MAX5060)/V CC
(MAX5061) bypass capacitors, driver output of the
MAX5060/MAX5061, MOSFET gates, and PGND.
Minimize the loop formed by the V CC bypass
capacitors, bootstrap diode, bootstrap capacitor,
MAX5060/MAX5061, and upper MOSFET gate.
8) Place the bank of output capacitors close to the load.
9) Distribute the power components evenly across the
board for proper heat dissipation.
10) Provide enough copper area at and around the
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
11) Use 4oz copper to keep the trace inductance and
resistance to a minimum. Thin copper PC boards
can compromise efficiency since high currents are
involved in the application. Also, thicker copper
conducts heat more effectively, thereby reducing
thermal impedance.
______________________________________________________________________________________
27
相关PDF资料 |
PDF描述 |
|---|---|
| MAX5065EAI+ | IC REG CTRLR BUCK PWM CM 28-SSOP |
| MAX5066AUI+T | IC REG CTRLR BUCK PWM CM 28TSSOP |
| MAX5068DAUE+ | IC REG CTRLR FLYBK ISO 16-TSSOP |
| MAX5069CAUE+ | IC REG CTRLR ISO PWM CM 16-TSSOP |
| MAX5070AAUA+T | IC REG CTRLR FLYBK DIV ISO 8UMAX |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5060ATI+ | 功能描述:DC/DC 开关控制器 .6-5.5V Parallelable Average-Current-Mode RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX5060ATI+T | 功能描述:DC/DC 开关控制器 .6-5.5V Parallelable Average-Current-Mode RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX5060ATI-T | 功能描述:DC/DC 开关控制器 .6-5.5V Parallelable Average-Current-Mode RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX5060ETI | 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| MAX5060ETI+ | 功能描述:DC/DC 开关控制器 .6-5.5V Parallelable Average-Current-Mode RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
发布紧急采购，3分钟左右您将得到回复。