参数资料
型号: MAX5066AUI+T
厂商: Maxim Integrated Products
文件页数: 21/22页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM CM 28TSSOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
PWM 型: 电流模式
输出数: 2
频率 - 最大: 1MHz
电源电压: 4.75 V ~ 28 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 28-SOIC(0.173",4.40mm 宽)裸露焊盘
包装: 带卷 (TR)
Configurable, Single-/Dual-Output, Synchronous
Buck Controller for High-Current Applications
Calculate C CFF such that:
8) Distribute the power components evenly across the
top side for proper heat dissipation.
C CFF =
1
2 × π × f C × 10 × R CF
9) Keep AGND and PGND isolated and connect them
at one single point close to the IC. Do not connect
them together anywhere else.
where C CFF is C11 and C13 in Figure 6.
Applications Information
Independant Turn-On and Off
The MAX5066 can be used to regulate two outputs
from one controller. Each of the two outputs can be
turned on and off independently of one another by con-
trolling the enable input of each phase (EN1 and EN2).
10) Place all input bypass capacitors for each input as
close to each other as is practical.
Pin Configuration
TOP VIEW
A logic-low on each enable pin shuts down the
MOSFET drivers for that phase. When the voltage on
the enable pin exceeds 1.2V, the drivers are turned on
and the output can come up to regulation. This method
of turning on the outputs allows the MAX5066 to be
used for power sequencing.
CSN2 1
CSP2 2
EAOUT2 3
EAN2 4
CLP2 5
28 EN2
27 BST2
26 DH2
25 LX2
24 DL2
PC Board Layout Guidelines
Careful PC board layout is critical to achieve low loss-
es, low output noise, and clean and stable operation.
This is especially true for dual-phase converters where
one channel can affect the other. Use the following
guidelines for PC board layout:
1) Place the V DD , REG, and the BST1 and BST2
bypass capacitors close to the MAX5066.
2) Minimize all high-current switching loops.
3) Keep the power traces and load connections short.
REF 6
RT/CLKIN 7
AGND 8
MODE 9
CLP1 10
EAN1 11
EAOUT1 12
CSP1 13
CSN1 14
MAX5066
*EXPOSED PADDLE
23 PGND
22 IN
21 REG
20 V DD
19 DL1
18 LX1
17 DH1
16 BST1
15 EN1
This practice is essential for high efficiency. Use
thick copper PC boards (2oz or higher) to enhance
efficiency and minimize trace inductance and
resistance.
4) Run the current-sense lines CSP_ and CSN_ very
close to each other to minimize loop areas. Do not
cross these critical signal lines through power cir-
cuitry. Sense the current right at the pads of the
current-sense resistors.
5) Place the bank of output capacitors close to the
load.
6) Isolate the power components on the top side from
the analog components on the bottom side with a
ground plane in between.
7) Provide enough copper area around the switching
MOSFETs, inductors, and sense resistors to aid in
thermal dissipation and reducing resistance.
TSSOP
*CONNECT EXPOSED PAD TO GROUND PLANE.
Chip Information
TRANSISTOR COUNT: 6252
PROCESS: BiCMOS
______________________________________________________________________________________
21
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MAX5066EUI 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX5066EUI+ 功能描述:DC/DC 开关控制器 Synch Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX5066EUI+T 功能描述:DC/DC 开关控制器 Synch Buck Controller RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX5066EUI-T 功能描述:DC/DC 开关控制器 RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK
MAX5066EVKIT 功能描述:电源管理IC开发工具 MAX5066 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V