参数资料
| 型号： | MAX5316GTG+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/33页 |
| 文件大小： | 0K |
| 描述： | IC DAC 16BIT SPI 24TQFN |
| 产品培训模块： | Obsolescence Mitigation Program |
| 标准包装： | 60 |
| 设置时间： | 3µs |
| 位数： | 16 |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 电压电源： | 模拟和数字，双 ± |
| 功率耗散（最大）： | 2.29W |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x5） |
| 包装： | 管件 |
| 输出数目和类型： | 1 电压，单极；1 电压，双极 |
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2
MAX5316
16-Bit, ±1 LSB Accuracy Voltage Output
DAC with SPI Interface
AGND to DGND ...................................................-0.3V to +0.3V
AGND_F, AGND_S to AGND ...............................-0.3V to +0.3V
AGND_F, AGND_S to DGND ...............................-0.3V to +0.3V
AVDD_ to AGND .....................................................-0.3V to +6V
AVDD_ to REF .........................................................-0.3V to +6V
AVSS to AGND........................................................-2V to +0.3V
VDDIO to DGND.......................................................-0.3V to +6V
BYPASS to DGND .......................................-0.3V to the lower of
(VAVDD_ or VDDIO + 0.3V) and +6V
OUT, REFO, RFB to AGND .........................-0.3V to the lower of
(VAVDD_ + 0.3V) and +6V
REF to AGND ..............................................-0.3V to the lower of
VAVDD and +6V
SCLK, DIN, CS, BUSY, LDAC, READY,
M/Z, TC/SB, RST, PD, DOUT to DGND.......-0.3V to the lower of
(VDDIO + 0.3V) and +6V
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 28.6mW/NC above +70NC) ...............2285.7mW
Operating Temperature Range........................ -40NC to +105NC
Maximum Junction Temperature.....................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Case Thermal Resistance (
qJA) ..............1.8°C/W
Junction-to-Ambient Thermal Resistance (
qJA) ..........35°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VAVDD_ = VDDIO = 4.5V to 5.5V, VAVSS = -1.25V, VAGND = VDGND = VAGND_F = VAGND_S = 0V, VREF = 4.096V, TC/SB = PD = LDAC
= M/Z = DGND, RST = VDDIO, CREFO = 100pF, CL = 100pF, RL = 10kω, CBYPASS = 1F, TA = -40°C to +105°C, unless otherwise
noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
N
16
Bits
Integral Nonlinearity (Note 3)
INL
DIN = 0x0000 to 0xFFFF (binary
mode), DIN = 0x8000 to 0x7FFF (two’s
complement mode)
-1
Q
0.25
+1
LSB
DIN = 0x0640 to 0xFFFF (binary
mode), DIN = 0x8280 to 0x7FFF (two’s
complement mode), VAVSS = 0V
Differential Nonlinearity (Note 3)
DNL
-1
Q
0.25
+1
LSB
Zero Code Error
OE
DIN = 0, TA = +25NC
-19
Q
1
+19
LSB
DIN = 0, TA = -40NC to +105NC
Q
6
Zero Code Error Drift
DIN = 0
-2.5
Q
0.4
+2.5
ppm/NC
Gain Error
GE
TA = +25NC
-4
Q
0.25
+4
LSB
TA = -40NC to +105NC
Q
3
Gain Error Temperature
Coefficient
TCGE
-2.75
Q
0.6
+2.75
ppm/NC
of FSR
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| MAX5316GTG+ | 功能描述:数模转换器- DAC 16-bit V Out SPI DAC w/Digi Gain & Offset RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5316GTG+T | 功能描述:数模转换器- DAC 16-bit V Out SPI DAC w/Digi Gain & Offset RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5317GTG+ | 功能描述:数模转换器- DAC 16Bit DAC w/Digital Gain/Offset Control RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5317GTG+T | 功能描述:数模转换器- DAC 16Bit DAC w/Digital Gain/Offset Control RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5318GTG+ | 功能描述:数模转换器- DAC 18-bit V Out SPI DAC w/Digi Gain & Offset RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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