参数资料
型号: MAX532ACPE+
厂商: Maxim Integrated Products
文件页数: 9/16页
文件大小: 0K
描述: IC MDAC 12BIT DUAL SER 16-DIP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 25
设置时间: 2.5µs
位数: 12
数据接口: 串行
转换器数目: 2
电压电源: 双 ±
功率耗散(最大): 842mW
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: 16-DIP(0.300",7.62mm)
供应商设备封装: 16-PDIP
包装: 管件
输出数目和类型: 2 电压,单极;2 电压,双极
采样率(每秒): *
产品目录页面: 1425 (CN2011-ZH PDF)
MAX532
Dual, Serial-Input,
Voltage-Output, 12-Bit MDAC
2
_______________________________________________________________________________________
Pin Voltages
VDD to DGND, AGNDA, AGNDB........................-0.3V to +17V
VSS to DGND, AGNDA, AGNDB (Note 1) ..........+0.3V to -17V
VREFA, VREFB.............................(VSS - 0.3V) to (VDD + 0.3V)
AGNDA, AGNDB .....................(DGND - 0.3V) to (VDD + 0.3V)
VOUTA, VOUTB ...........................(VSS - 0.3V) to (VDD + 0.3V)
RFBA, RFBB.................................(VSS - 0.3V) to (VDD + 0.3V)
SCLK, DIN, DOUT,
LDAC, CS ..(DGND - 0.3V) to (VDD + 0.3V)
DOUT Sink Current .............................................................20mA
Continuous Power Dissipation (TA = +70°C)
Plastic DIP (derate 10.53mW/°C above +70°C) ..........842mW
Wide SO (derate 9.52mW/°C above +70°C)................762mW
CERDIP (derate 10.00mW/°C above +70°C) ...............800mW
Operating Temperature Ranges:
MAX532_C__ ......................................................0°C to +70°C
MAX532_E__....................................................-40°C to +85°C
MAX532_MJE ................................................-55°C to +125°C
Junction Temperatures:
MAX532_C__, E__........................................................+150°C
MAX532_MJE...............................................................+175°C
Storage Temperature Range ........................... -65°C to +160°C
Lead Temperature (soldering, 10sec) ........................... +300°C
ELECTRICAL CHARACTERISTICS
(VDD = 11.4V to 16.5V, VSS = -11.4V to -16.5V, AGNDA = AGNDB = DGND = 0V, VREFA and VREFB = +10V, RL = 2k,
CL = 100pF, VOUT_ connected to RFB_, TA = TMIN to TMAX, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
SYMBOL
Resolution
INL
12
Bits
Relative Accuracy
±1
LSB
Differential Nonlinearity
Guaranteed monotonic
±1
LSB
±1/2
MAX532A
MAX532B
±2
TA = +25°C, MAX532_
±3
Zero-Code Offset Error
DAC latch loaded
with all 0s
±4
mV
TA = TMIN to TMAX, MAX532B
±5
V/°C
DAC latch loaded with all 0s
±2
MAX532A
TA = +25°C, DAC latch
loaded with all 1s
±5
MAX532B
±0.5
±3.0
%
810
13
k
±2
ppm/°C
of FSR
Gain Error
TA = TMIN to TMAX, DAC
latch loaded with all 1s
±7
LSB
MAX532B
±4
MAX532A
TA = TMIN to TMAX, MAX532A
Zero-Code Offset
Temperature Coefficient
Gain-Error Temperature
Coefficient
VREFA, VREFB Input
Resistance
VREFA, VREFB Input
Resistance Matching
STATIC PERFORMANCE (Note 1)
REFERENCE INPUTS (VREFA, VREFB)
Note 1: If VSS is open-circuited with VDD and either AGND applied, the VSS pin will float positive, exceeding the Absolute Maximum Ratings.
A Schottky diode connected between VSS and GND ensures the maximum ratings will not be exceeded.
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