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参数资料
| 型号： | MAX5725AEVKIT# |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/35页 |
| 文件大小： | 0K |
| 描述： | EVAL KIT MAX5725 |
| 标准包装： | 1 |
| 系列： | * |
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MAX5723/MAX5724/MAX5725
Ultra-Small, Octal-Channel, 8-/10-/12-Bit Buffered
Output DACs with Internal Reference and SPI Interface
2
Maxim Integrated
VDD, VDDIO to GND ................................................-0.3V to +6V
OUT_, REF to GND....0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, CSB, IRQ, M/Z, LDAC, CLR to GND...........-0.3V to +6V
DIN, DOUT to GND .....................................-0.3V to the lower of
(VDDIO + 0.3V) and +6V
Continuous Power Dissipation (TA = +70NC)
TSSOP (derate at 13.6mW/NC above 70NC)..............1084mW
WLP (derate at 21.3mW/NC above 70NC)..................1700mW
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature.................................... -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Lead Temperature (TSSOP only)(soldering, 10s)...........+300NC
Soldering Temperature (reflow) .................................... +260NC
TSSOP
Junction-to-Ambient Thermal Resistance (θJA) ......73.8NC/W
Junction-to-Case Thermal Resistance (θJC) ..............20NC/W
WLP
Junction-to-Ambient Thermal Resistance (θJA)
(Note 2) ...................................................................47NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 2: Visit www.maximintegrated.com/app-notes/index.mvp/id/1891 for information about the thermal performance of WLP packaging.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI, TA = -40NC to +125NC, unless otherwise noted.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (Note 4)
Resolution and Monotonicity
N
MAX5723
8
Bits
MAX5724
10
MAX5725
12
Integral Nonlinearity (Note 5)
INL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.2
+0.5
MAX5725
-1
Q
0.5
+1
Differential Nonlinearity (Note 5)
DNL
MAX5723
-0.25
Q
0.05
+0.25
LSB
MAX5724
-0.5
Q
0.1
+0.5
MAX5725
-1
Q
0.2
+1
Offset Error (Note 6)
OE
-5
Q
0.5
+5
mV
Offset Error Drift
Q
10
F
V/NC
Gain Error (Note 6)
GE
-1.0
Q
0.1
+1.0
%FS
Gain Temperature Coefficient
With respect to VREF
Q
3.0
ppm of
FS/NC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5725AEVKIT# | 功能描述:数据转换 IC 开发工具 MAX5725 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| MAX5725AWP+T | 功能描述:数模转换器- DAC 8Ch 12Bit Buffered Output DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5725BAUP+ | 功能描述:数模转换器- DAC MAX5725BAUP+ RoHS:否 制造商:Maxim Integrated 转换器数量: DAC 输出端数量: 转换速率: 分辨率: 接口类型: 稳定时间: 最大工作温度: 安装风格: 封装 / 箱体: 封装:Tube |
| MAX5725BAUP+T | 制造商:Maxim Integrated Products 功能描述:ULTRA-SMALL, OCTAL-CHANNEL, 8-/10-/12-BIT BUFFERED OUTPUT DA - Tape and Reel 制造商:Maxim Integrated Products 功能描述:IC DAC 12BIT SPI/SRL 8CH 20TSSOP 制造商:Maxim Integrated Products 功能描述:Digital to Analog Converters - DAC MAX5725BAUP+T |
| MAX5725EVKIT# | 制造商:Maxim Integrated Products 功能描述:EV KIT FOR MAX5725 12B 8 CHANNEL DAC WITH SPI INTERFACE - Boxed Product (Development Kits) |
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