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参数资料
| 型号： | MAX5864ETM+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/26页 |
| 文件大小： | 0K |
| 描述： | IC ANLG FRONT END 22MSPS 48-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 43 |
| 位数： | 10 |
| 通道数： | 4 |
| 功率（瓦特）： | 2.10W |
| 电压 - 电源，模拟： | 2.7 V ~ 3.3 V |
| 电压 - 电源，数字： | 1.8 V ~ 3.3 V |
| 封装/外壳： | 48-WFQFN 裸露焊盘 |
| 供应商设备封装： | 48-TQFN-EP（7x7） |
| 包装： | 管件 |
MAX5864
Ultra-Low-Power, High Dynamic-
Performance, 22Msps Analog Front End
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND, OVDD to OGND................................-0.3V to +3.3V
GND to OGND.......................................................-0.3V to +0.3V
IA+, IA-, QA+, QA-, ID+, ID-, QD+, QD-, REFP, REFN,
REFIN, COM to GND ..............................-0.3V to (VDD + 0.3V)
DD0–DD9, SCLK, DIN, CS, CLK,
DA0–DA7 to OGND .............................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70
°C)
48-Pin Thin QFN (derate 26.3mW/
°C above +70°C) ..........2.1W
Thermal Resistance
θJA.................................................+38°C/W
Operating Temperature Range ...........................-40
°C to +85°C
Junction Temperature ......................................................+150
°C
Storage Temperature Range .............................-60
°C to +150°C
Lead Temperature (soldering, 10s) .................................+300
°C
ELECTRICAL CHARACTERISTICS
(VDD = 3V, OVDD = 1.8V, internal reference (1.024V), CL
≈ 10pF on all digital outputs, fCLK = 22MHz, ADC input amplitude = -0.5dBFS,
DAC output amplitude = 0dBFS, differential ADC input, differential DAC output, CREFP = CREFN = CCOM = 0.33F, Xcvr mode, unless
otherwise noted. Typical values are at TA = +25
°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER REQUIREMENTS
Analog Supply Voltage
VDD
2.7
3.0
3.3
V
Output Supply Voltage
OVDD
1.8
VDD
V
ADC operating mode, fIN = 5.5MHz, fCLK =
22MHz, DAC operating mode, fOUT = 2.2MHz
14
16.5
ADC operating mode, fIN = 5.5MHz, fCLK =
15.36MHz, DAC operating mode, fOUT =
2.2MHz
11.4
ADC operating mode (Rx), fIN = 5.5MHz,
fCLK = 15.36MHz, DAC off, DAC digital
inputs at zero or DVDD
8.25
DAC operating mode (Tx), fOUT = 2.2MHz,
fCLK = 15.36MHz, ADC off
8
Standby mode, DAC digital inputs and CLK
at zero or OVDD
2.0
Idle mode, DAC digital inputs at zero or
OVDD, fCLK = 22MHz
6.7
mA
VDD Supply Current
Shutdown mode, digital inputs and CLK at
zero or OVDD, CS = OVDD
1A
ADC operating mode, fIN = 5.5MHz, fCLK =
22MHz, DAC operating mode, fOUT = 2.2MHz
2.3
mA
Idle mode, DAC digital inputs at zero or
OVDD, fCLK = 22MHz
20.6
OVDD Supply Current
Shutdown mode, DAC digital inputs and
CLK at zero or OVDD, CS = OVDD
1
A
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5864ETM+ | 功能描述:ADC / DAC多通道 10-Bit 2Ch 22Msps CODEC/AFE RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5864ETM+T | 功能描述:ADC / DAC多通道 10-Bit 2Ch 22Msps CODEC/AFE RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5864ETM-T | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5865ETM | 功能描述:ADC / DAC多通道 RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
| MAX5865ETM+ | 功能描述:ADC / DAC多通道 10-Bit 2Ch 40Msps CODEC/AFE RoHS:否 制造商:Texas Instruments 转换速率: 分辨率:8 bit 接口类型:SPI 电压参考: 电源电压-最大:3.6 V 电源电压-最小:2 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-40 |
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