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参数资料
| 型号： | MAX5873EGK+D |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/16页 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT 200MSPS DUAL 68-QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 30 |
| 设置时间： | 14ns |
| 位数： | 12 |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 300mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 68-VFQFN 裸露焊盘 |
| 供应商设备封装： | 68-QFN 裸露焊盘（10x10） |
| 包装： | 管件 |
| 输出数目和类型： | 4 电流，单极 |
| 采样率（每秒）： | 200M |
| 产品目录页面： | 1398 (CN2011-ZH PDF) |
MAX5873
12-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
14
______________________________________________________________________________________
The MAX5873 requires five separate power-supply inputs
for analog (AVDD1.8 and AVDD3.3), digital (DVDD1.8 and
DVDD3.3), and clock (AVCLK) circuitry. Decouple each
AVDD, DVDD, and AVCLK input pin with a separate 0.1F
capacitor as close to the device as possible with the
shortest possible connection to the ground plane (Figure
8). Minimize the analog and digital load capacitances for
optimized operation. Decouple all three power-supply
voltages at the point they enter the PCB with tantalum or
electrolytic capacitors. Ferrite beads with additional
decoupling capacitors forming a pi-network could also
improve performance.
The analog and digital power-supply inputs AVDD3.3,
AVCLK, and DVDD3.3 allow a 3.135V to 3.465V supply
voltage range. The analog and digital power-supply
inputs AVDD1.8 and DVDD1.8 allow a 1.71V to 1.89V
supply voltage range.
The MAX5873 is packaged in a 68-pin QFN-EP pack-
age, providing greater design flexibility, increased ther-
mal efficiency, and optimized DAC AC performance.
The EP enables the use of necessary grounding tech-
niques to ensure highest performance operation.
Thermal efficiency is not the key factor, since the
MAX5873 features low-power operation. The exposed
pad ensures a solid ground connection between the
DAC and the PCB’s ground layer.
The data converter die attaches to an EP lead frame with
the back of this frame exposed at the package bottom
surface, facing the PCB side of the package. This allows
for a solid attachment of the package to the PCB with
standard infrared reflow (IR) soldering techniques. A spe-
cially created land pattern on the PCB, matching the size
of the EP (6mm x 6mm), ensures the proper attachment
and grounding of the DAC. Refer to the MAX5873 EV kit
data sheet. Designing vias into the land area and imple-
menting large ground planes in the PCB design allow
for the highest performance operation of the DAC. Use an
array of at least 4 x 4 vias (≤ 0.3mm diameter per via hole
and 1.2mm pitch between via holes) for this 68-pin QFN-
EP package.
Connect the MAX5873 exposed paddle to
GND. Vias connect the land pattern to internal or external
copper planes. Use as many vias as possible to the
ground plane to minimize inductance.
Static Performance Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best straight-line fit
(closest approximation to the actual transfer curve) or a
line drawn between the end points of the transfer func-
tion, once offset and gain errors have been nullified.
For a DAC, the deviations are measured at every indi-
vidual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees a
monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and
the actual offset current. For a DAC, the offset point is
the average value at the output for the two midscale
digital input codes with respect to the full scale of the
DAC. This error affects all codes by the same amount.
MAX5873
12
OUTIP/OUTQP
OUTIN/OUTQN
DATA11–DATA0
GND
25
50
25
OUTP
OUTN
Figure 7. Differential Output Configuration
MAX5873
12
OUTIP/OUTQP
OUTIN/OUTQN
DATA11–DATA0
0.1F
AVDD1.8
DVDD1.8
0.1F
AVDD3.3
DVDD3.3
0.1F
AVCLK
BYPASSING—DAC LEVEL
*BYPASS EACH POWER-SUPPLY PIN INDIVIDUALLY.
Figure 8. Recommended Power-Supply Decoupling and
Bypassing Circuitry
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5873EGK-TD | 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5873EVKIT | 功能描述:数模转换器- DAC Evaluation Kit for the MAX5873 MAX5874 MAX5875 RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5874EGK | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX5874EGK+D | 功能描述:数模转换器- DAC 14-Bit 2Ch 200Msps DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| MAX5874EGK+TD | 功能描述:数模转换器- DAC 14-Bit 2Ch 200Msps DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
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