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参数资料
| 型号： | MAX6622UE9A+ |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/18页 |
| 文件大小： | 196K |
| 描述： | IC PREC TEMP MONITOR 5CH 16TSSOP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 96 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部和外部 |
| 感应温度： | -40°C ~ 125°C，外部传感器 |
| 精确度： | -0.1°C 本地，±3°C 远程 |
| 拓扑： | ADC，缓冲器，寄存器库 |
| 输出类型： | SMBus? |
| 输出警报： | 是 |
| 输出风扇： | 是 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 16-TSSOP |
| 包装： | 管件 |
5-Channel Precision Temperature Monitor
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, SMBCLK, SMBDATA, ALERT, OVERT,
STBY to GND .......................................................-0.3V to +6V
DXP_ to GND..............................................-0.3V to (V
CC
+ 0.3V)
DXN2, DXN3, DXN4 to GND .................................-0.3V to +0.8V
SMBDATA, ALERT, OVERT Current....................-1mA to +50mA
DXN Current .......................................................................?mA
Continuous Power Dissipation (T
A
= +70癈)
16-Pin TSSOP
(derate 11.1mW/癈 above +70癈)..............................888.9mW
Junction-to-Case Thermal Resistance (?/DIV>
JC
) (Note A)
16-Pin TSSOP ..............................................................27癈/W
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) (Note A)
16-Pin TSSOP...............................................................90癈/W
ESD Protection (all pins, Human Body Model)................?000V
Operating Temperature Range .........................-40癈 to +125癈
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-60癈 to +150癈
Lead Temperature (soldering, 10s).................................+300癈
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +5.5V, V
STBY
= V
CC
, T
A
= -40癈 to +125癈, unless otherwise noted. Typical values are at V
CC
= +3.3V and
T
A
= +25癈.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.0
5.5
V
Software Standby Supply Current
I
SS
SMBus static
30
礎
Operating Current
I
CC
During conversion
500
1000
礎
Channel 1 only
11
Temperature Resolution
Other diode channels
8
Bits
T
A
= T
RJ
= +60癈 to +100癈
-1.0
+1.0
Remote Temperature Accuracy
V
CC
= 3.3V
T
A
= T
RJ
= 0癈 to +125癈
-3.0
+3.0
o
C
T
A
= +60癈 to +100癈
-4.4
-0.4
Local Temperature Accuracy
V
CC
= 3.3V
T
A
= 0癈 to +125癈
-6.1
-0.1
o
C
Supply Sensitivity of Temperature
Accuracy
?.2
o
C/V
Resistance cancellation off
95
125
156
Remote Channel 1 Conversion
Time
t
CONV1
Resistance cancellation on
190
250
312
ms
Remote Channels 2 Through 4
Conversion Time
t
CONV_
95
125
156
ms
High level
80
100
120
Remote-Diode Source Current
I
RJ
Low level
8
10
12
礎
Undervoltage-Lockout Threshold
UVLO
Falling edge of V
CC
disables ADC
2.30
2.80
2.95
V
Undervoltage-Lockout Hysteresis
90
mV
Power-On-Reset (POR) Threshold
V
CC
falling edge
1.2
2.0
2.5
V
POR Threshold Hysteresis
90
mV
ALERT, OVERT
I
SINK
= 1mA
0.3
Output Low Voltage
V
OL
I
SINK
= 6mA
0.5
V
Output Leakage Current
1
礎
Note A: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
4-layer board. For detailed information on package thermal considerations, refer to Application Note 4083 available
at www.maxim-ic.com/thermal-tutorial.
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