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| 型号： | MAX6626RMTT+T |
| 厂商： | Maxim Integrated |
| 文件页数： | 2/14页 |
| 文件大小： | 421K |
| 描述： | IC TEMP SENSOR I2C 6-TDFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部 |
| 感应温度： | -55°C ~ 125°C |
| 精确度： | ±1°C（最小值） |
| 拓扑： | ADC，比较器，寄存器库 |
| 输出类型： | I²C?/SMBus? |
| 输出警报： | 是 |
| 输出风扇： | 是 |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WDFN 裸露焊盘 |
| 供应商设备封装： | 6-TDFN 裸露焊盘（3x3） |
| 包装： | 带卷 (TR) |
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(+3V d V
S
d +5.5V, T
A =
-55癈 to +125癈, unless otherwise noted.)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
S
to GND ................................................................-0.3V to +6V
OT, SCL, SDA to GND..............................................-0.3V to +6V
ADD to GND .................................................-0.3V to (V
S
+ 0.3V)
Current into Any Pin............................................................?mA
OT Sink Current.................................................................. 20mA
Continuous Power Dissipation
6-Pin SOT23 (derate 9.1mW/癈 above +70癈)............727mW
6-Pin TDFN (derate 23.8mW/癈 above +70癈) .........1905mW
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-60癈 to +150癈
ESD Rating (Human Body Model)......................................2000V
Lead Temperature.............................................................Note 1
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
Power-Supply Voltage
V
S
3.0
5.5
V
I
2
C-compatible active
1
mA
I
2
C-compatible inactive
250
礎
Quiescent Current
I
C
Shutdown mode
1
礎
MAX6625
9
ADC Resolution
MAX6626
12
Bits
MAX6625
0.5
Temperature Resolution
MAX6626
0.0625
癈/LSB
T
A
= +25癈, V
S
= +3V to +3.6V
?
0癈 = T
A
d +50癈, V
S
= +3.0V to +3.6V
?.5
Accuracy (Notes 2, 3)
0癈 = T
A
d +70癈, V
S
= +3.0V to +3.6V
?.0
癈
Power-Supply Sensitivity
V
S
= +3V to +5.5V
1
癈/V
Conversion Time
t
C
133
ms
OT Pullup Resistor
R
P
MAX6625R, MAX6626R only
25
50
k&
OT Saturation Voltage (Note 4)
V
L
I
OUT
= 4mA (Note 4)
0.8
V
OT Delay
(Programmable through fault queue)
1 ?t
C
6 ?t
C
ms
T
HIGH
Default Temperature
T
HIGH
80
癈
T
LOW
Default Temperature
T
LOW
75
癈
I
2
C-COMPATIBLE I/O: SCL, SDA, ADD
V
S
< +3.6V
2
Input High Voltage
V
IH
V
S
> +3.6V
3
V
Input Low Voltage
V
IL
0.8
V
Input Hysteresis
0.2
V
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