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参数资料
| 型号： | MAX708TCUA-TG |
| 厂商： | ON Semiconductor |
| 文件页数： | 10/10页 |
| 文件大小： | 0K |
| 描述： | IC MPU SUPERVISORY 3.08V 8MICRO |
| 标准包装： | 4,000 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 推挽式，图腾柱 |
| 复位： | 高有效/低有效 |
| 复位超时： | 最小为 140 ms |
| 电压 - 阀值： | 3.08V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | Micro8? |
| 包装： | 带卷 (TR) |
| 其它名称： | MAX708TCUA-TGOS |
MAX707, MAX708
PACKAGE DIMENSIONS
SOIC?8
CASE 751?07
ISSUE AG
NOTES:
?X?
8
A
5
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
?Y?
B
1
4
S
0.25 (0.010)
M
Y
M
K
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751?01 THRU 751?06 ARE OBSOLETE. NEW
STANDARD IS 751?07.
G
DIM
MILLIMETERS
MIN MAX
INCHES
MIN MAX
?Z?
H
D
0.25 (0.010)
M
Z Y
C
S
X
SEATING
PLANE
0.10 (0.004)
S
N
X 45 _
M
J
A
B
C
D
G
H
J
K
M
N
S
4.80 5.00
3.80 4.00
1.35 1.75
0.33 0.51
1.27 BSC
0.10 0.25
0.19 0.25
0.40 1.27
0 _ 8 _
0.25 0.50
5.80 6.20
0.189 0.197
0.150 0.157
0.053 0.069
0.013 0.020
0.050 BSC
0.004 0.010
0.007 0.010
0.016 0.050
0 _ 8 _
0.010 0.020
0.228 0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
0.6
0.024
4.0
0.155
1.270
0.050
SCALE 6:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Micro8 is a trademark of International Rectifier.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT :
N. American Technical Support : 800?282?9855 Toll Free
ON Semiconductor Website : http://onsemi.com
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082?1312 USA
USA/Canada
Order Literature : http://www.onsemi.com/litorder
Fax : 480?829?7709 or 800?344?3867 Toll Free USA/Canada
Phone : 480?829?7710 or 800?344?3860 Toll Free USA/Canada Japan : ON Semiconductor, Japan Customer Focus Center
2?9?1 Kamimeguro, Meguro?ku, Tokyo, Japan 153?0051
Email : orderlit@onsemi.com Phone : 81?3?5773?3850
http://onsemi.com
10
For additional information, please contact your
local Sales Representative.
MAX707/D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX708TCUA-TG-CUT TAPE | 制造商:ON 功能描述:MAX708 Series 3.08 V 200 ms Reset 制造商:ON 功能描述:MAX708 Series 3.08 V 200 ms Reset ? Supervisory Circuits - Micro-8 |
| MAX708TEPA | 功能描述:监控电路 RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX708TEPA+ | 功能描述:监控电路 Single uPower Supervisor RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX708TESA | 功能描述:监控电路 RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| MAX708TESA+ | 功能描述:监控电路 Single uPower Supervisor RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
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