参数资料
型号: MAX7359ETG+
厂商: Maxim Integrated Products
文件页数: 20/20页
文件大小: 0K
描述: IC KEY SWITCH 2WIRE 24-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 86
应用: 移动电话,PDA,播放器
接口: I²C
电源电压: 1.65 V ~ 3.6 V
封装/外壳: 24-WFQFN 裸露焊盘
供应商设备封装: 24-TQFN-EP(3.5x3.5)
包装: 管件
安装类型: 表面贴装
MAX7359
2-Wire Interfaced Low-EMI
Key Switch Controller/GPO
_______________________________________________________________________________________
9
REGISTER BIT
DESCRIPTION
VALUE
FUNCTION
DEFAULT VALUE
0
Sleep mode
D7
Sleep
1
Operating mode
I2C write, autosleep and
autowakeup all can
change this bit. This bit
can be read back by
I2C any time for current
status.
0
D6
Reserved
0
This bit must always be 0. Improper operation
may result by writing a 1 to this location.
0
INT cleared when FIFO empty
D5
INTERRUPT
1
INT cleared after host read.
In this mode, I2C should read FIFO until
interrupt condition removed, or further INT
may be lost.
0
D4
Reserved
0
This bit must always be 0. Improper operation
may result by writing a 1 to this location.
0
Disable
D3
Key release enable
1
Enable
1
D2
Reserved
0
This bit must always be 0. Improper operation
results by writing a 1 to this location.
0
Disable
D1
Wakeup
1
Key press wakeup enable
1
0I2C timeout enabled
D0
Timeout enable
1I2C timeout disabled
0
Table 4. Configuration Register Format (0x01)
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MAX7359ETG+ 功能描述:外围驱动器与原件 - PCI Low-EMI Key Switch Controller/GPIO RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray
MAX7359ETG+G47 功能描述:外围驱动器与原件 - PCI 2-Wire Interfaced Low-EMI Switch RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray
MAX7359ETG+T 功能描述:外围驱动器与原件 - PCI Low-EMI Key Switch Controller/GPIO RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray
MAX7359ETG+TG47 功能描述:外围驱动器与原件 - PCI 2-Wire Interfaced Low-EMI Key Switch Controller/GPO RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray
MAX7359EVKIT+ 功能描述:外围驱动器与原件 - PCI MAX7359 Eval Kit RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray