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| 型号： | MAX7360ETL+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 12/32页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR KEY-SW I2C 40TQFN-EP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 控制器 |
| 输入类型： | 逻辑 |
| 输出类型： | 逻辑 |
| 接口： | I²C，2 线串口 |
| 电流 - 电源： | 50µA |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
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2
Maxim Integrated
I2C-Interfaced Key-Switch Controller and LED
Driver/GPIOs with Integrated ESD Protection
MAX7360
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VCC to GND............................................................. -0.3V to +4V
COL0–COL7, ROW0–ROW7 to GND ...................... -0.3V to +4V
SDA, SCL, AD0, INTI, INTK to GND........................ -0.3V to +6V
PORT0–PORT7 to GND......................................... -0.3V to +16V
All Other Pins to GND................................-0.3V to (VCC + 0.3V)
DC Current on PORT0–PORT7, COL2–COL7 ....................25mA
GND Current.......................................................................80mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 22.2mW/NC above +70NC)..................1777mW
WLP (derate 21.7mW/NC above +70NC)....................1739mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
ESD Protection
Human Body Model (RD = 1.5kI, CS = 100pF)
All Pins.............................................................................Q2kV
IEC 61000-4-2 (RD = 330I, CS = 150pF)
Contact Discharge
ROW0–ROW7, COL0–COL7, PORT0–PORT7 to GND....Q8kV
Air-Gap Discharge
ROW0–ROW7, COL0–COL7, PORT0–PORT7 to GND..Q15kV
Lead Temperature (TQFN only; soldering, 10s)..............+300NC
Soldering Temperature (reflow).......................................+260NC
ELECTRICAL CHARACTERISTICS
(VCC = +1.62V to +3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25NC.) (Notes 2, 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a single-
layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ......... 45NC/W
Junction-to-Case Thermal Resistance (BJC) ................ 2NC/W
WLP
Junction-to-Ambient Thermal Resistance (BJA) WLP. 46NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Supply Voltage
VCC
1.62
3.3
3.6
V
External Supply Voltage
PORT0–PORT7
VPORT_
14
V
Operating Supply Current
ICC
All key switches open, oscillator running,
COL2–COL7 configured as key switches,
VPORT_ = VCC
34
50
F
A
N keys pressed
34 +
20 x N
Sleep-Mode Supply Current
ISL
1.3
3
F
A
Key-Switch Source Current
IKEY
20
35
F
A
Key-Switch Source Voltage
VKEY
0.43
0.5
V
Key-Switch Resistance
RKEY
(Note 4)
5
kI
Startup Time from Shutdown
tSTART
2
2.4
ms
Output Low Voltage
COL2–COL7
VOL
ISINK = 10mA
0.5
V
Oscillator Frequency (PWM
Clock)
fOSC
TA = +25NC, VCC = +2.61V
125
128
131
kHz
TA = TMIN to TMAX, VCC P 3.6V
102
164
Oscillator Frequency Variation
D
fOSC
TA = +25NC
-7
+14
%
Key-Scan Frequency
fKEY
Derived from oscillator clock
64
kHz
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