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参数资料
| 型号： | MAX8621YETG+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 16/18页 |
| 文件大小： | 0K |
| 描述： | IC PMIC W/DC-DC SUP 24-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 手持/移动设备 |
| 电源电压： | 2.6 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-WFQFN 裸露焊盘 |
| 供应商设备封装： | 24-TQFN-EP（4x4） |
| 包装： | 带卷 (TR) |
Dual Step-Down DC-DC Power-Management ICs
for Portable Devices
The die junction temperature can be calculated as follows:
T J = T A + P D × θ JA
When operating at an ambient temp of +70°C under the
above conditions:
Connect GND and PGND_ to the ground plane. The
external feedback network should be very close to the
FB pin, within 0.2in (5mm). Keep noisy traces, such as
the LX node, as short as possible. Connect GND to the
exposed paddle directly under the IC. Refer to the
MAX8621Y/MAX8621Z evaluation kit for an example PC
board layout and routing.
T J = 70 ° C + 1 . 182 W ? 36
? = 112 . 6 ° C
?
?
° C ?
W ?
Chip Information
T J should not exceed +150°C in normal operating con-
ditions.
Printed Circuit Board Layout and Routing
High switching frequencies and relatively large peak
currents make the PC board layout a very important
aspect of design. Good design minimizes excessive
EMI on the feedback paths and voltage gradients in the
ground plane, both of which can result in instability or
regulation errors. Connect C IN_ close to IN_ and GND.
TRANSISTOR COUNT: 5850
PROCESS: BiCMOS
Pin Configuration
TOP VIEW
Connect the inductor and output capacitors (C OUT_ ) as
close to the IC as possible and keep the traces short,
18
17
16
15
14
13
direct, and wide.
The traces between C OUT_ , C FF_ , and FB_ are sensitive
to inductor magnetic field interference. Route these
traces between ground planes or keep the traces away
DR 19
PGND2 20
LX2 21
12 OUT1
11 RESET
10 IN2
from the inductors.
IN1 22
LX1 23
PGND1 24
MAX8621Y
MAX8621Z
9
8
7
OUT2
EN2
EN3
1
2
3
4
5
6
A "+" SIGN WILL REPLACE THE FIRST PIN INDICATOR ON LEAD-FREE PACKAGES.
16
______________________________________________________________________________________
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX8621ZETG | 功能描述:PMIC 解决方案 Dual Step-Down PMIC for Portable Devices RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel |
| MAX8621ZETG+ | 功能描述:PMIC 解决方案 Dual Step-Down PMIC for Portable Devices RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel |
| MAX8621ZETG+T | 功能描述:PMIC 解决方案 Dual Step-Down PMIC for Portable Devices RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel |
| MAX8621ZETG-T | 功能描述:PMIC 解决方案 Dual Step-Down PMIC for Portable Devices RoHS:否 制造商:Texas Instruments 安装风格:SMD/SMT 封装 / 箱体:QFN-24 封装:Reel |
| MAX8621ZEVKIT | 制造商:Maxim Integrated Products 功能描述:DUAL STEP-DOWN POWER MANAGEMENT IC - Rail/Tube |
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