参数资料
型号: MAX8830EWE+T
厂商: Maxim Integrated
文件页数: 14/16页
文件大小: 0K
描述: IC LED DRVR WHITE BCKLGT 16-UCSP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
拓扑: 线性(LDO),PWM,升压(升压)
输出数: 5
内部驱动器:
类型 - 主要: 背光,闪灯/白光
类型 - 次要: 白色 LED
频率: 750kHz ~ 1.25MHz
电源电压: 2.7 V ~ 5.5 V
输出电压: 3.8 V ~ 5.2 V
安装类型: 表面贴装
封装/外壳: 16-WLP
供应商设备封装: 16-WLP(2x2)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
LED Light Management IC in
2.5mm x 2.5mm UCSP
Table 7. Suggested Inductors
MANUFACTURER
Cooper (Coiltronics)
FDK
TDK
TOKO
SERIES
SD3114
MIPF2520
MIPW3226
VLF3012AT
DE2812C
INDUCTANCE
(μH)
2.2
2.2
2.2
2.2
10
2.7
10
DCR
(m Ω )
110
80
100
88
360
75
325
I SAT
(A)
1.74
1.3A
1.1
1.0
0.49
1.8
0.78
DIMENSIONS
(L TYP x W TYP x H MAX = VOLUME)
3.0 x 3.0 x 1.45 = 13mm 3
2.5 x 2.0 x 1.0 = 5mm 3
3.2 x 2.6 x 1.0 = 8mm 3
2.8 x 2.6 x 1.2 = 9mm 3
3.0 x 3.2 x 1.2 = 12mm 3
3.0 x 3.2 x 1.2 = 12mm 3
Inductor Selection
The MAX8830 is designed to use a 2.2μH to 10μH
inductor. To prevent core saturation, ensure that the
inductor-saturation current rating exceeds the peak
inductor current for the application. Calculate the worst-
case peak inductor current with the following formula:
PCB Layout
Due to fast switching waveforms and high-current
paths, careful PCB layout is required. Connect GND
and PGND directly to the ground plane. The IN bypass
capacitor should be placed as close as possible to the
IC. R COMP and C COMP should be connected between
I PEAK =
V OUT × I OUT ( MAX )
0 . 9 × V IN ( MIN )
+
V IN ( MIN ) × 0 . 5 μ s
2 × L
COMP and GND as close as possible to the IC.
Minimize trace lengths between the IC and the induc-
tor, the input capacitor, and the output capacitor; keep
Table 7 provides a list of suggested inductors.
Capacitor Selection
Bypass the input to GND and PGND using a ceramic
capacitor. A ceramic capacitor with X5R and X7R
dielectrics are recommended for their low ESR and
tighter tolerances over a wide temperature range. Place
the capacitor as close as possible to the IC. The recom-
mended minimum value for the input capacitor is 10μF;
however, larger value capacitors can be used to reduce
input ripple at the expense of size and higher cost.
these traces short, direct, and wide. The ground con-
nections of C IN and C OUT should be as close together
as possible and connected to PGND. The traces from
the input to the inductor and from the output capacitor
to the LEDs may be longer. A sample layout is available
in the MAX8830 evaluation kit.
Pin Configuration
MAX8830
The output capacitance required depends on the maxi-
1
2
3
4
mum output current. A 10μF ceramic capacitor works
well in most situations, but a 4.7μF capacitor is accept-
able for lower load currents.
COMP Network Selection
The step-up converter is compensated for stability through
an external compensation network from COMP to GND.
A
B
+
FLED
LED2
PGND
LED3
LX
MVON
OUT
IN
See Table 8 for recommended compensation components.
C
Table 8. Suggested Compensation
LED1
FLEN
SCL
COMP
Networks
R COMP
C COMP
D
LED4
GND
SDA
V DD
(k Ω )
(pF)
UCSP
2.2μH Inductor (Dynamic Loads)
4.7μH Inductor (Dynamic Loads)
10μH Inductor (Dynamic Loads)
Only LED Loads (2.2μH to 10μH)
4.3
3
3
0 (short)
2200
4700
6800
22000
PROCESS: BiCMOS
(2.5mm x 2.5mm)
Chip Information
14
______________________________________________________________________________________
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