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| 型号： | MAX8855ETJ+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/20页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK ADJ 5A DL 32TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 2 |
| 输出电压： | 0.6 V ~ 3.24 V |
| 输入电压： | 2.35 V ~ 3.6 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 1MHz ~ 2MHz |
| 电流 - 输出： | 5A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
Dual, 5A, 2MHz Step-Down Regulators
ABSOLUTE MAXIMUM RATINGS
IN_, LX_, V DD , VDL, PWRGD_ to GND..................-0.3V to +4.5V
V DD , VDL to IN_.....................................................-0.3V to +4.5V
EN_, SS_, COMP_, FB_, REFIN, FSYNC to GND ......-0.3V to the
lower of (V VDD + 0.3V) and (V VDL + 0.3V)
Continuous LX_ Current (Note 1) ...................................5.5A RMS
BST_ to LX_ ...........................................................-0.3V to +4.5V
PGND_ to GND......................................................-0.3V to +0.3V
Continuous Power Dissipation (T A = +70°C)
32-Pin TQFN (5mm x 5mm)
(derate 34.5mW/°C above +70°C) ..........................2758.6mW
Operating Ambient Temperature Range .............-40°C to +85°C
Operating Junction Temperature Range ...........-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: LX_ have internal clamp diodes to PGND_ and IN_. Applications that forward bias these diodes should take care not to
exceed the IC’s package power-dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Junction-to-Ambient Thermal Resistance ( θ JA ) ...........29°C/W
Junction-to-Case Thermal Resistance ( θ JC ) ...............1.7°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN_ = V VDD = V VDL = 3.3V, V FB_ = 0.5V, V SS_ = V REFIN = 600mV, PGND_ = GND, R FSYNC = 10k Ω , L = 0.47μH, C BST_ = 0.1μF,
C SS_ = 0.022μF, PWRGD_ not connected; T A = -40°C to +85°C, typical values are at T A = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
IN1, IN2, VDL, VDD
IN_, VDL, and V DD Voltage Range
IN_ Supply Current
V DD + VDL Supply Current
(Note 3)
1MHz switching, no load
1MHz switching, V DD = VDL
MAX8855
MAX8855A
V IN _ = 2.5V
V IN _ = 3.3V
V VDD = 2.5V
V VDD = 3.3V
2.35
2.25
1.9
2.8
7.2
10
3.60
3.60
3.5
5
15
V
mA
mA
Shutdown Supply Current
(I IN1 + I IN2 + I VDD + I VDL )
V IN _ = V VDD = V VDL = V BST _ - T A = +25°C
V LX _ = 3.6V, V EN _ = 0V T A = +85°C
0.3
11
μA
IN_, V DD Undervoltage Lockout Threshold
UVLO Monitors V DD , IN1, and IN2
Rising
Falling
1.8
2.0
1.9
2.2
V
IN_, V DD Undervoltage Lockout Deglitch
BST1, BST2
2
μs
Shutdown BST_ Current
V IN _ = V VDD = V VDL = V BST _ =
3.6V, V EN _ = 0V, V LX _ = 0 or 3.6V
T A = +25°C
T A = +85°C
0.02
2
μA
COMP1, COMP2
COMP_ Clamp Voltage, High
V VDD = V IN _ = 2.25V to 3.6V, V FB _ = 0.7V
1.80
2.00
2.25
V
COMP_ Slew Rate
1.40
V/μs
COMP_ Shutdown Resistance
From COMP_ to GND, V EN _ = 0V
7
25
Ω
2
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