参数资料
型号: MAX8969EWL33+T
厂商: Maxim Integrated Products
文件页数: 2/15页
文件大小: 0K
描述: IC REG BOOST SYNC 3.3V 1A 9WLP
产品培训模块: Obsolescence Mitigation Program
标准包装: 2,500
类型: 升压(升压)
输出类型: 固定
输出数: 1
输出电压: 3.3V
输入电压: 2.5 V ~ 5.5 V
频率 - 开关: 3MHz
电流 - 输出: 1A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 9-WFBGA,WLBGA
包装: 带卷 (TR)
供应商设备封装: 9-WLP(1.3x1.3)
MAX8969
Step-Up Converter
for Handheld Applications
ABSOLUTE MAXIMUM RATINGS
IN, OUT_ to GND_ ................................................-0.3V to +6.0V
EN, TREN to GND_ ............ -0.3V to lower of (V IN + 0.3V) or 6V
Total LX_ Current........................................................... 3.2A RMS
OUT_ Short Circuit to GND_ .....................................Continuous
Operating Temperature Range .......................... -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Soldering Temperature (reflow) (Note 1) ........................+260 N C
Continuous Power Dissipation (T A = +70 N C)
WLP (derate 12mW/ N C above +70 N C).........................960mW
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the
device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro-
files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
WLP
Junction-to-Ambient Thermal Resistance ( B JA ) ..........83 N C/W
Junction-to-Case Thermal Resistance ( B JC ) ...............50 N C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 2.6V, T A = -40 N C to +85 N C, unless otherwise noted. Typical values are T A = +25 N C.) (Note 3)
PARAMETER
Operating Input Voltage Range
CONDITIONS
MIN
2.5
TYP
MAX
5.5
UNITS
V
Minimum Startup Voltage
2.3
V
Undervoltage Lockout Threshold (UVLO)
Shutdown Supply Current
Thermal Shutdown
V IN falling, 75mV hysteresis
V EN = V TREN = V OUT = 0V,
V IN = 4.8V
T A rising, 20 N C hysteresis
T A = +25 N C
T A = +85 N C
2.1
2.2
0.8
1
+165
2.3
5
V
F A
N C
BOOST MODE
Peak Output Current
V IN > 2.5V (Note 4)
V OUT = 3.3V
V OUT = 3.5V
1
0.9
0.8
A
Continuous Output Current
V IN > 2.5V, pulse
load
V OUT = 3.7V
V OUT = 4.25V
0.7
0.7
A
V OUT = 4.7V
V OUT = 5.0V
0.7
0.7
Switching Frequency
(Note 4)
3
MHz
No load, V OUT _ TARGET = 3.3V
No load, V OUT _ TARGET = 3.5V
3.175
3.40
3.30
3.50
3.40
3.60
Output Voltage Accuracy
No load, V OUT _ TARGET = 3.7V
No load, V OUT _ TARGET = 4.25V
No load, V OUT _ TARGET = 5V
3.64
4.10
4.85
3.75
4.25
5.00
3.85
4.35
5.10
V
2
Maxim Integrated
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