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参数资料
| 型号： | MAX9312ETJ+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/9页 |
| 文件大小： | 0K |
| 描述： | IC CLK/DATA BUFF 1:5 3GHZ 32TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 类型： | 扇出缓冲器（分配），数据 |
| 电路数： | 2 |
| 比率 - 输入:输出： | 1:5 |
| 差分 - 输入:输出： | 是/是 |
| 输入： | HSTL，LVECL，LVPECL |
| 输出： | LVECL，LVPECL |
| 频率 - 最大： | 3GHz |
| 电源电压： | 2.25 V ~ 3.8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 供应商设备封装： | 32-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
MAX9312/MAX9314
Dual 1:5 Differential LVPECL/LVECL/HSTL
Clock and Data Drivers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC - VEE = +2.25V to +3.8V, outputs loaded with 50 ±1% to VCC - 2V.) (Notes 2–5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC - VEE...............................................................................4.1V
Inputs (CLK_, CLK_) .............................VEE - 0.3V to VCC + 0.3V
CLK_ to CLK_ ....................................................................±3.0V
Continuous Output Current .................................................50mA
Surge Output Current........................................................100mA
VBB Sink/Source Current ...............................................±0.65mA
Continuous Power Dissipation (TA = +70°C)
32-Pin LQFP (derate 20.7mW/°C above +70°C) ....1652.9mW
32-Pin TQFN (derate 34.5mW/°C above +70°C)....2758.6mW
Junction-to-Case Thermal Resistance (TJC) (Note A)
32-Pin LQFP ................................................................12°C/W
32-Pin TQFN ..................................................................2°C/W
Junction-to-Ambient Thermal Resistance (TJA) (Note 1)
32-Pin LQFP .............................................................48.4°C/W
32-Pin TQFN ................................................................29°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Human Body Model (CLK_, CLK_, Q_, Q_) ........................2kV
Soldering Temperature (10s) ...........................................+300°C
-40
°C
+25
°C
+85
°C
PARAMETER
SYMBOL
CONDITIONS
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
INPUTS (CLK_,
CLK_)
MAX9312
VCC -
1.23
VCC
VCC -
1.23
VCC
VCC -
1.23
VCC
Single-Ended
Input High
Voltage
VIH
VBB
connected
to CLK_
(VIL for VBB
connected
to CLK_)
MAX9314
VCC -
1.165
VCC
VCC -
1.165
VCC
VCC -
1.165
VCC
V
MAX9312
VEE
VCC -
1.62
VEE
VCC -
1.62
VEE
VCC -
1.62
Single-Ended
Input Low
Voltage
VIL
VBB
connected
to CLK_
(VIL for VBB
connected
to CLK_)
MAX9314
VEE
VCC -
1.475
VEE
VCC -
1.475
VEE
VCC -
1.475
V
High Voltage of
Differential Input
VIHD
VEE +
1.2
VCC
VEE +
1.2
VCC
VEE +
1.2
VCC
V
Low Voltage of
Differential Input
VILD
VEE
VCC -
0.095
VEE
VCC -
0.095
VEE
VCC -
0.095
V
For VCC - VEE
< 3.0V
0.095
VCC -
VEE
0.095
VCC -
VEE
0.095
VCC -
VEE
Differential Input
Voltage
VIHD -
VILD
For VCC - VEE
≥ 3.0V
0.095
3.0
0.095
3.0
0.095
3.0
V
Input High
Current
IIH
150
A
CLK_ Input Low
Current
IILCLK
-10
+10
-10
+10
-10
+10
A
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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